UPC29L33J NEC [NEC], UPC29L33J Datasheet - Page 12

• Manufacturer Part Number: UPC29L33J
• Description: THREE TERMINAL LOW DROPOUT VOLTAGE REGULATOR
• Manufacturer: NEC [NEC]

RECOMMENDED SOLDERING CONDITIONS
different conditions.
TYPES OF THROUGH HOLE MOUNT DEVICE
TYPES OF SURFACE MOUNT DEVICE
REFERENCE
12
PC29L00J Series
PC29L00T Series
Wave soldering
Infrared ray reflow
Vapor phase soldering
Wave soldering
NEC semiconductor device reliability/quality control system.
Quality grade on NEC semiconductor devices.
Semiconductor device mounting technology manual.
Semiconductor device package manual.
Guide to quality assurance for semiconductor devices.
Semiconductor selection guide.
The following conditions (see table below) must be met when soldering this product.
Please consult with our sales offices in case other soldering process is used, or in case soldering is done under
For more details, refer to our document “Semiconductor Device Mounting Manual” (IEI-1207).
Note Exposure limit before soldering after dry-pack package is opened.
Remark Storage conditions: 25 ˚C and relative humidity at 65 % or less.
Caution Do not apply more than a single process at once, except for “Partial heating method”.
Soldering Process
Soldering Process
Solder temperature: 260 ˚C or below.
Flow Time: 10 seconds or below.
Peak package’s temperature: 235 ˚C or below.
Reflow time: 30 seconds or below (210 ˚C or higher).
Number of flow process: 2. Exposure limit
Peak package’s temperature: 215 ˚C or below.
Reflow time: 40 seconds or below (200 ˚C or higher).
Number of flow process: 2. Exposure limit
Solder temperature: 260 ˚C or below.
Flow time: 10 seconds or below.
Number of flow process: 1. Exposure limit
Document Name
Soldering Conditions
Soldering Conditions
Note
Note
Note
: None.
: None.
: None.
PC29L00 Series
Document No.
IEI-1212
IEI-1209
IEI-1207
IEI-1213
MEI-1202
MF-1134
WS60-00-1
VP15-00-2
IR35-00-2
Symbol
Symbol