UPC1944 NEC [NEC], UPC1944 Datasheet - Page 9

• Manufacturer Part Number: UPC1944
• Description: ADJUSTABLE PRECISION SHUNT REGULATORS
• Manufacturer: NEC [NEC]

RECOMMENDED SOLDERING CONDITIONS
consult with our sales offices.
Type of Surface Mount Device
Type of Through-hole Device
When soldering these products, there are highly recommended to observe the conditions as shown below.
If other soldering processes are used, or if the soldering is performed under different conditions, please make sure to
For more details, refer to our document “Semiconductor Device Mounting Technology Manual” (C10535E).
Caution Apply only one kind of soldering condition to a device, or the device will be damaged by heat stress.
Caution Apply only one kind of soldering condition to a device, or the device will be damaged by heat stress.
Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure
Infrared ray reflow
VPS
Wave soldering
Infrared ray reflow
VPS
Wave soldering
Wave soldering (only to leads)
PC1943T, 1944T : Power mini mold (SOT-89)
PC1944GR : 8-pin plastic SOP (5.72 mm (225))
PC1944J : 3-pin plastic SIP (TO-92)
that the package body does not get jet soldered.
Process
Process
Process
Peak temperature: 235 C or below (Package surface temperature),
Solder temperature: 260 C or below, Flow time: 10 seconds or less.
Reflow time: 30 seconds or less (at 210 C or higher),
Maximum number of reflow processes: 2 times.
Peak temperature: 215 C or below (Package surface temperature),
Reflow time: 40 seconds or less (at 200 C or higher),
Maximum number of reflow processes: 2 times.
Solder temperature: 260 C or below, Flow time: 10 seconds or less,
Maximum number of flow processes: 1 time,
Pre-heating temperature: 120 C or below (Package surface temperature).
Peak temperature: 235 C or below (Package surface temperature),
Reflow time: 30 seconds or less (at 210 C or higher),
Maximum number of reflow processes: 1 time.
Peak temperature: 215 °C or below (Package surface temperature),
Reflow time: 40 seconds or less (at 200 C or higher),
Maximum number of reflow processes: 1 time.
Solder temperature: 260 C or below, Flow time: 10 seconds or less,
Maximum number of flow processes: 1 time,
Pre-heating temperature: 120 C or below (Package surface temperature).
Data Sheet G10239EJ3V0DS00
Conditions
Conditions
Conditions
PC1943,1944
WS60-00-1
WS60-00-1
VP15-00-2
VP15-00-1
IR35-00-2
IR35-00-1
Symbol
Symbol
9