SG2000_1 MICROSEMI [Microsemi Corporation], SG2000_1 Datasheet - Page 7

• Manufacturer Part Number: SG2000_1
• Description: HIGH VOLTAGE MEDIUM CURRENT DRIVER ARRAYS
• Manufacturer: MICROSEMI [Microsemi Corporation]

Rev 1.3b
Copyright
CONNECTION DIAGRAMS & ORDERING INFORMATION
Note 1. Contact factory for JAN and DESC product availability.
DW Package: RoHS Compliant / Pb-free Transition DC: 0516
DW Package: RoHS / Pb-free 100% Matte Tin Lead Finish
DW Package (Not Pictured) is 16-Pin Wide Body SOIC, same pinout as J package pictured above.
16-PIN PLASTIC DIP
N - PACKAGE
20-PIN CERAMIC
LEADLESS CHIP CARRIER
L- PACKAGE
16-PIN CERAMIC DIP
J - PACKAGE
Package
2. All parts are viewed from the top.
3. See selection guide for specific device types.
1997
Part No.
SG2003N
SG2023N
SG2XXXL/883B
SG2XXXL
SG2XXXJ/883B
SG2023J/DESC
JAN2001J
JAN2002J
JAN2003J
JAN2004J
SG2XXXJ
(Note 3)
Temperature Range
-55 C to 125 C
-55 C to 125 C
-55 C to 125 C
-55 C to 125 C
-55 C to 125 C
-55 C to 125 C
-55 C to 125 C
-55 C to 125 C
-55 C to 125 C
0 C to 70 C
0 C to 70 C
Ambient
7
(See Notes Below)
N Package: RoHS Compliant / Pb-free Transition DC: 0503
N Package: RoHS / Pb-free 100% Matte Tin Lead Finish
Connection Diagram
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11861 Western Avenue
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1
[phone]
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10
9
Garden Grove, CA 92841
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FAX: [phone]