ADC12L030CIWM National Semiconductor, ADC12L030CIWM Datasheet - Page 10

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ADC12L030CIWM

Manufacturer Part Number
ADC12L030CIWM
Description
3.3V Self-Calibrating 12-Bit Plus Sign Serial I/O A/D Converters with MUX and Sample/Hold
Manufacturer
National Semiconductor
Datasheet
www.national.com
AC Electrical Characteristics
Note 5: The human body model is a 100 pF capacitor discharged through a 1.5 k
Note 6: See AN450 “Surface Mounting Methods and Their Effect on Product Reliability” or the section titled “Surface Mount” found in any post 1986 National Semi-
conductor Linear Data Book for other methods of soldering surface mount devices.
Note 7: Two on-chip diodes are tied to each analog input through a series resistor as shown below. Input voltage magnitude up to 5V above V
will not damage this device. However, errors in the A/D conversion can occur (if these diodes are forward biased by more than 50 mV) if the input voltage magnitude
of selected or unselected analog input go above V
V
Note 8: To guarantee accuracy, it is required that the V
pin.
Note 9: With the test condition for V
Note 10: Typicals are at T
Note 11: Tested limits are guaranteed to National’s AOQL (Average Outgoing Quality Level).
Note 12: Positive integral linearity error is defined as the deviation of the analog value, expressed in LSBs, from the straight line that passes through positive
full-scale and zero. For negative integral linearity error, the straight line passes through negative full-scale and zero (see Figure 2 and Figure 3 ).
Note 13: Zero error is a measure of the deviation from the mid-scale voltage (a code of zero), expressed in LSB. It is the worst-case value of the code transitions
between 1 to 0 and 0 to +1 (see Figure 4 ).
Note 14: Total unadjusted error includes offset, full-scale, linearity and multiplexer errors.
Note 15: The DC common-mode error is measured in the differential multiplexer mode with the assigned positive and negative input channels shorted together.
Note 16: Channel leakage current is measured after the channel selection.
Note 17: Timing specifications are tested at the TTL logic levels, V
to 1.4V.
Note 18: The ADC12L030 family’s self-calibration technique ensures linearity and offset errors as specified, but noise inherent in the self-calibration process will re-
sult in a maximum repeatability uncertainty of 0.2 LSB.
Note 19: If SCLK and CCLK are driven from the same clock source, then t
Note 20: The “12-Bit Conversion of Offset” and “12-Bit Conversion of Full-Scale” modes are intended to test the functionality of the device. Therefore, the output
data from these modes are not an indication of the accuracy of a conversion result.
DC
to ensure accurate conversions.
J
= T
A
= 25˚C and represent most likely parametric norm.
REF
(V
REF
ADC12L030CIWM
ADC12L032CIWM
ADC12L034CIWM
ADC12L038CIWM
+ − V
A
+ or below GND by more than 50 mV. As an example, if V
REF
Part Number
A
−) given as +2.500V the 12-bit LSB is 610 µV and the 8-bit LSB is 9.8 mV.
+ and V
(Continued)
D
+ be connected together to the same power supply with separate bypass capacitors at each V
IL
= 0.4V for a falling edge and V
A
is 6, 10, 18 or 34 clock periods minimum and maximum.
10
resistor into each pin.
Resistance
Thermal
70˚C/W
64˚C/W
57˚C/W
50˚C/W
DS011830-6
IH
JA
= 2.4V for a rising edge. TRI-STATE output voltage is forced
A
+ is 3.0 V
DC
, full-scale input voltage must be 3.05
A
+ or 5V below GND
+

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