PCF88331 Philips Semiconductors, PCF88331 Datasheet - Page 107

• Manufacturer Part Number: PCF88331
• Description: STN RGB - 132 X 132 X 3 driver
• Manufacturer: Philips Semiconductors

Philips Semiconductors
Table 100 Bonding pad dimensions
2003 Feb 14
handbook, full pagewidth
Minimum bump pitch
Bump dimensions
Bump height
Wafer thickness (excluding bumps)
STN RGB - 132
Fig.61 Bonding pads dimensions.
ITEM
2.34
mm
132
handbook, halfpage
Fig.62 Alignment circle detail (80 m diameter).
3 driver
y
y
center
x
columns: 46.464
all other: 52.800
columns: 28.424
all other: 32.736
15
381
PC8833-1
22.93 mm
107
x
center
pitch
DIMENSIONS
MGU975
95.348
105.248
80
m
MGU974
Objective specification
PCF8833
m
m
m
m
UNIT