AD8331 Analog Devices, AD8331 Datasheet - Page 32

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AD8331

Manufacturer Part Number
AD8331
Description
Ultralow Noise VGAs with Preamplifier and Programmable RIN
Manufacturer
Analog Devices
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
AD8331ARQZ
Manufacturer:
ADI/亚德诺
Quantity:
20 000
AD8331/AD8332
OUTLINE DIMENSIONS
ORDERING GUIDE
AD8331/AD8332
Models
AD8331ARQ
AD8331ARQ-REEL
AD8331ARQ-REEL7
AD8331-EVAL
AD8332ARU
AD8332ARU-REEL
AD8332ARU-REEL7
AD8332ACP-REEL
AD8332ACP-REEL7
AD8332-EVAL
© 2003 Analog Devices, Inc. All rights reserved. Trademarks
and registered trademarks are the property of their respective owners.
0.15
0.05
COPLANARITY
1.00
0.85
0.80
PIN 1
Figure 82. 28-Lead Thin Shrink Small Outline Package [TSSOP] (RU-28)
0.10
12° MAX
SEATING
PLANE
Figure 83. 32-Lead Frame Chip Scale Package [LFCSP] (CP-32)
2 8
1
COMPLIANT TO JEDEC STANDARDS MO-153AE
BSC SQ
PIN 1
INDICATOR
VIEW
5.00
TOP
0.30
0.19
0.65
BSC
0.80 MAX
0.65 TYP
0.30
0.23
0.18
COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2
Dimensions shown in millimeters
Dimensions shown in millimeters
9.80
9.70
9.60
BSC SQ
0.20 REF
4.75
Temperature Range
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
0.05 MAX
0.02 NOM
1.20 MAX
SEATING
PLANE
0.60 MAX
1 5
1 4
COPLANARITY
BSC
0.50
0.50
0.40
0.30
0.08
0.20
0.09
4.50
4.40
4.30
C03199-0-11/03(C)
24
17
16
25
0.60 MAX
6.40 BSC
BOTTOM
VIEW
8 °
0 °
32
9
Package Description
Shrink Small Outline Package 150 mil Body, 25 mil pitch
Shrink Small Outline Package 150 mil Body, 25 mil pitch
Shrink Small Outline Package 150 mil Body, 25 mil pitch
Evaluation Board with AD8331ARQ
Thin Shrink Small Outline Package (TSSOP)
Thin Shrink Small Outline Package (TSSOP)
Thin Shrink Small Outline Package (TSSOP)
Lead Frame Chip Scale Package (LFCSP)
Lead Frame Chip Scale Package (LFCSP)
Evaluation Board with AD8332ARU
8
1
3.50 REF
0.75
0.60
0.45
3.25
3.10 SQ
2.95
PIN 1
INDICATOR
0.25 MIN
Rev. C | Page 32 of 32
COPLANARITY
0.010
0.004
PIN 1
0.004
20
0.065
0.049
Figure 84. 20 Lead Shrink Outline [QSOP] (RQ-20)
1
COMPLIANT TO JEDEC STANDARDS MO-137AD
0.025
BSC
Dimensions shown in millimeters
0.341
BSC
0.012
0.008
0.069
0.053
10
11
SEATING
PLANE
0.154
BSC
0.236
BSC
0.010
0.006
Package Outline
RQ-20
RQ-20
RQ-20
RU-28
RU-28
RU-28
CP-32
CP-32
0.050
0.016

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