UPC8100 NEC, UPC8100 Datasheet - Page 15

• Manufacturer Part Number: UPC8100
• Description: SILICON UP/DOWN CONVERTERS IC FOR 800 MHz to 900 MHz MOBILE COMMUNICATIONS
• Manufacturer: NEC

NOTE ON CORRECT USE
RECOMMENDED SOLDERING CONDITIONS
the recommended conditions are to be consulted with our sales representatives.
Note:
Infrared ray reflow
VPS
Wave soldering
Partial heating method
This product should be soldered in the following recommended conditions. Other soldering method and conditions than
*:
(1) Observe precautions for handling because of electrostatic sensitive devices.
(2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired oscillation).
(3) Keep the track length of the ground pins as short as possible.
(4) Connect a bypass capacitor (e.g. 1 000 pF) to the V
PC8100GR
Exposure limit before soldering after dry-pack package is opened.
Storage conditions: 25 C and relative humidity at 65 % or less.
Apply only a single process at once, except for “Partial heating method”.
For details of recommended soldering conditions for surface mounting, refer to information document SEMICONDUCTOR
DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
Soldering
process
Peak package’s surface temperature: 235 C or below,
Reflow time: 30 seconds or below (210 C or higher),
Number of reflow process: 2, Exposure limit*: None
Peak package’s surface temperature: 215 C or below,
Reflow time: 40 seconds or below (200 C or higher),
Number of reflow process: 2, Exposure limit*: None
Solder temperature: 260 C or below,
Flow time: 10 seconds or below
Number of flow process: 1, Exposure limit*: None
Terminal temperature: 300 C or below,
Flow time: 10 seconds or below,
Exposure limit*: None
Soldering conditions
Data Sheet P10817EJ3V0DS00
CC
pin.
WS60–00-1
VP15–00-2
IR35–00-2
PC8100GR
Symbol
15