UPC358 NEC, UPC358 Datasheet - Page 9

• Manufacturer Part Number: UPC358
• Description: LOW POWER DUAL OPERATIONAL AMPLIFIERS
• Manufacturer: NEC

RECOMMENDED SOLDERING CONDITIONS
soldering processes are used, or if the soldering is performed under different conditions, please make sure to consult
with our sales offices.
(C10535E).
Type of Surface Mount Device
Caution Apply only one kind of soldering condition to a device, except for “partial heating method”, or the
Types of Through-hole Device
Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure
PC358G2: 8-pin plastic SOP (225 mil)
PC358C: 8-pin plastic DIP (300 mil)
PC358HA: 9-pin slim SIP
Vapor phase soldering
Wave soldering
Partial heating method
Wave soldering
(only to leads)
Partial heating method
Infrared ray reflow
When soldering these products, it is highly recommended to observe the conditions as shown below. If other
For more details, refer to our document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL”
Process
Process
device will be damaged by heat stress.
that the package body does not get jet soldered.
Peak temperature: 230 C or below (Package surface temperature),
Solder temperature: 260 C or below,
Flow time: 10 seconds or less.
Reflow time: 30 seconds or less (at 210 C or higher),
Maximum number of reflow processes: 1 time.
Peak temperature: 215 C or below (Package surface temperature),
Reflow time: 40 seconds or less (at 200 C or higher),
Maximum number of reflow processes: 1 time.
Solder temperature: 260 C or below, Flow time: 10 seconds or less,
Maximum number of flow processes: 1 time,
Pre-heating temperature: 120 C or below (Package surface temperature).
Pin temperature: 300 C or below,
Heat time: 3 seconds or less (Per each side of the device).
Pin temperature: 300 C or below,
Heat time: 3 seconds or less (per each lead).
Conditions
Conditions
WS60-00-1
VP15-00-1
IR30-00-1
Symbol
PC358
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