LTC3614 LINER [Linear Technology], LTC3614 Datasheet - Page 4

• Manufacturer Part Number: LTC3614
• Description: 4A, 4MHz Monolithic Synchronous Step-Down DC/DC Converter
• Manufacturer: LINER [Linear Technology]

LTC3614
ELECTRICAL CHARACTERISTICS
SYMBOL
PGOOD
t
R
V
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2: The LTC3614E is guaranteed to meet performance specifi cations
over the 0°C to 85°C operating junction temperature range. Specifi cations
over the –40°C to 125°C operating junction temperature range are
assured by design, characterization and correlation with statistical process
controls. The LTC3614I is guaranteed to meet specifi cations over the
full –40°C to 125°C operating junction temperature range. Note that
the maximum ambient temperature is determined by specifi c operating
conditions in conjunction with board layout, the rated package thermal
resistance and other environmental factors.
Note 3: This parameter is tested in a feedback loop which servos V
the midpoint for the error amplifi er (V
Note 4: External compensation on ITH pin.
TYPICAL PERFORMANCE CHARACTERISTICS
4
temperature range, otherwise specifi cations are at T
PGOOD
RUN
PGOOD
100
90
80
70
60
50
40
30
20
10
0
1
Effi ciency vs Load Current
Burst Mode Operation (V
V
OUT
= 1.8V
10
OUTPUT CURRENT (mA)
PARAMETER
Power Good Voltage Windows
Power Good Blanking Time
Power Good Pull-Down On-Resistance
RUN voltage
100
1000
MODE
ITH
V
V
V
IN
IN
IN
= 0.75V).
= 2.5V
= 3.3V
= 5V
3614 G01
= 0V)
10000
100
90
80
70
60
50
40
30
20
10
A
0
1
≈ T
CONDITIONS
TRACK/SS = SV
TRACK/SS = SV
Entering and Leaving Window
Input High
Input Low
Effi ciency vs Load Current
Burst Mode Operation (V
V
OUT
J
V
V
V
V
FB
FB
FB
FB
= 25°C. V
= 1.2V
The
FB
Ramping Up
Ramping Down
Ramping Up
Ramping Down
to
10
OUTPUT CURRENT (mA)
l
denotes the specifi cations which apply over the full operating junction
IN
IN
IN
, Entering Window
, Leaving Window
= 3.3V, RT/SYNC = SV
100
Note 5: Tying the ITH pin to SV
AVP mode.
Note 6: Dynamic supply current is higher due to the internal gate charge
being delivered at the switching frequency.
Note 7: See description of the TRACK/SS pin in the Pin Functions section.
Note 8: In sourcing mode the average output current is fl owing out of the
SW pin. In sinking mode the average output current is fl owing into the SW
Pin.
Note 9: See description of the MODE pin in the Pin Functions section.
Note 10: Guaranteed by correlation and design to wafer level
measurements for QFN packages.
Note 11: This IC includes overtemperature protection that is intended
to protect the device during momentary overload conditions. Junction
temperature will exceed 125°C when overtemperature protection is active.
Continuous operation above the specifi ed maximum operating junction
temperature may impair device reliability.
1000
MODE
V
V
V
IN
IN
IN
V
= 2.5V
= 3.3V
= 5V
IN
3614 G02
= 0V)
10000
= 3.3V, RT/SYNC = SV
l
l
IN
unless otherwise specifi ed (Notes 1, 2, 11).
100
MIN
90
80
70
60
50
40
30
20
10
IN
–3
70
0
3
8
1
1
enables the internal compensation and
Effi ciency vs Load Current
V
OUT
= 1.8V
10
IN
OUTPUT CURRENT (mA)
TYP
105
–6
–9
17
6
9
unless otherwise noted.
100
Burst Mode OPERATION
PULSE-SKIPPING
FORCED CONTINUOUS
MAX
–11
140
0.4
11
33
1000
UNITS
3614 G03
10000
3614f
μs
%
%
%
%
Ω
V
V