BPW329-1270-23AB11 ACTEL [Actel Corporation], BPW329-1270-23AB11 Datasheet - Page 3

• Manufacturer Part Number: BPW329-1270-23AB11
• Description: 329-31x31mm, 1.27mm E-TEC BGA SOKET
• Manufacturer: ACTEL [Actel Corporation]

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Ball / Land Grid Array Sockets
Sockets range from 5 x 5 upwards and some of the existing patterns are shown on the following
pages. Many more exist and your exact requirements can easily be added to our extensive product
library. The SMT socket is simply placed and reflowed onto the PCB in the same way as the chip and
occupies only a small amount of additional board space. The 1.27mm pitch screw lock socket extends
≈ 6,00 mm beyond the outer ball row with no fixing holes.
We aim to solve your requirements - many different terminals and configurations are available.
Your custom sets our standards!
Please note, we will always request the chip data to ensure we offer a compatible socket.
PCB Pad Layout
B
L
C
Ø 0,70mm/.028“ if pitch 1,27mm
Ø 0,60mm/.023“ if pitch 1,00mm
Ø 0,50mm/.019“ if pitch 0,80mm
Ø 0,30mm/.012“ if pitch 0,50mm
Device Type
The pitch dimension depends on your Ball Grid Array
= Ball Grid
= Land Grid
= Column Grid
Nbr of contacts
please refer to the
footprint pages
SMT Style
PCB Hole Layout
38 to 45
E-tec is now the leading BGA socket manufacturer.
Screw Lock Type
Device Material
C
P
Soldertail Style
dimensions if BGA Socket pitch 1,27mm with contact type 30
30 = standard SMT…
29 = raised SMT….....
28 = special raised SMT - only for 1.00 & 0.80mm pitch….....
70 = standard solder tail………...….
65 = special short solder tail - only for 1,27mm pitch………...
= Ceramic
= Plastic
X X W x x x x - x x x x - x x X X x x
Ø 0,40mm/.016” if pitch 0,80mm
Ø 0,35mm/.014” if pitch 0,50mm
Ø 0,45mm/.017” if pitch 1,27mm
Ø 0,29mm/.011” if pitch 1,00mm
Ø 0,29mm/.011” if pitch 0,80mm
Ø 0,25mm/.010” if pitch 0,50mm
Ø 0,60mm/.024” if pitch 1,27mm
Ø 0,50mm/.020” if pitch 1,00mm
PCB solder hole:
Coplanarity 0,10mm/.004”
Soldertail:
05 = 0,50mm
06 = 0,65mm
07 = 0,75mm
08 = 0,80mm
( „A“ = 1,20mm if 1,27mm pitch; 0,80mm if 1,00mm, 0.60 if 0,80mm pitch; 0,40mm if 0,50mm pitch )
( „A“ = 5,00mm if 1,27mm pitch; 3,20mm if 1,00mm; 2,80mm if 0,80mm pitch, 2.30mm if 0.50mm pitch )
How to order
Pitch
( „A“ = 3.30 if 1.27mm pitch, 2.80 if 1.00mm or 0.80mm pitch, 2,30mm if 0.50mm pitch )
10 = 1,00mm
12 = 1,27mm
15 = 1,50mm
EP patents 0829188, 0897655
US patents 6190181, 6249440
Patented in other countries.
Mechanical data
Contact life
Retention System life
Solderability
Individual contact force
Max. torque for retention screws
Material
Insulator
Terminal
Contact
Electrical data
Contact resistance
Current rating
Insulation resistance at 500V DC
Breakdown voltage at 60 Hz
Capacitance
Inductance
Operating temperature
Torque limiting screw driver
Solder paste
Solder profile
Contact Type
Important Note:
Please check the ball diameters & heights of your chip prior to
ordering the standard E-tec BGA (BPW/BCW) sockets. Any deviation
has to be communicated to E-tec in order to check compatibility with
the standard socket design and if necessary to obtain a special order
code adapted to your chip dimensions.
The standard solderball diameters & heights are the following:
Pitch
0.50mm
0.65mm
0.75mm & 0.80mm
1.00mm
1.27mm & 1.50mm
a) plastic chips (BPW)
b) ceramic chips (BCW) 0.60mm / 1.00mm
Grid Code Config Code
please refer to
( „A“ = 2,80mm )
( „A“ = 4,50mm )
the footprint
38 to 45
pages
Recommendations
Specifications
10.000 cycles min.
1.000 cycles min.
exceeds MIL-STD-202 Method 208
40 grams max.
up to 800 pins = 7cN per meter or 10 oz per inch
as of 800 pins = 7cN to 10cN per meter or 10 oz
to 14 oz per inch
Glass Epoxy FR 4
Brass
BeCu
< 100 m
500 mA max.
100 MΩ
500 MΩ
500V min.
< 1 pF
< 2 nH
−55°C to +130°C ; 220°C for 10 sec.
Refer to page “Tools” of this catalog
Please use a solderpaste w/o any silver!
Please refer to our website www.e-tec.ch
0.25mm / 0.35mm
0.25mm / 0.50mm
0.40mm / 0.55mm
0.50mm / 0.70mm
0.60mm / 1.00mm
will be given by
the factory after
chip datasheet
ball diameters
receipt of the
Ω
min/max
if 0.50 to 0.80mm pitch
1.00mm pitch upwards
0.15mm / 0.30mm
0.15mm / 0.30mm
0.25mm / 0.45mm
0.30mm / 0.50mm
0.50mm / 0.70mm
0.80mm / 1.00mm
01 = tin/gold
ball height
min/max
Plating