6N140A-100 HP [Agilent(Hewlett-Packard)], 6N140A-100 Datasheet - Page 2

• Manufacturer Part Number: 6N140A-100
• Description: Hermetically Sealed, Low IF, Wide VCC, High Gain Optocouplers
• Manufacturer: HP [Agilent(Hewlett-Packard)]

Selection Guide-Package Styles and Lead Configuration Options
*JEDEC registered part.
These devices have a 300%
minimum CTR at an input current
of only 0.5 mA making them ideal
for use in low input current
applications such as MOS, CMOS,
low power logic interfaces or line
receivers. Compatibility with high
voltage CMOS logic systems is
assured by specifying I
I
Upon special request, the follow-
ing device selections can be
made: CTR minimum of up to
600% at 0.5 mA, and lower
output leakage current levels to
100 A.
OH
Lead Style
Channels
Common Channel Wiring
Agilent Part # & Options
Commercial
MIL-PRF-38534 Class H
MIL-PRF-38534 Class K
Standard Lead Finish
Solder Dipped
Butt Cut/Gold Plate
Gull Wing/Soldered
Crew Cut/Gold Plate
Class H SMD Part #
Prescript for all below
Either Gold or Solder
Gold Plate
Solder Dipped
Butt Cut/Gold Plate
Butt Cut/Soldered
Gull Wing/Soldered
Crew Cut/Gold Plate
Crew Cut/Soldered
Class K SMD Part #
Prescript for all below
Either Gold or Solder
Gold Plate
Solder Dipped
Butt Cut/Gold Plate
Butt Cut/Soldered
Gull Wing/Soldered
Crew Cut/Gold Plate
Crew Cut/Soldered
at 18 Volts.
Package
CCH
and
6N140A/883B
Through Hole
9800201KEX
9800201KEC
9800201KEA
9800201KYC
9800201KXA
9800201KYA
9800201KZC
9800201KZA
Option #200
Option #100
Option #300
Option #600
HCPL-177K
8302401EX
8302401EC
8302401EA
8302401YC
8302401XA
16 pin DIP
8302401YA
8302401ZC
8302401ZA
Gold Plate
V
6N140A*
CC
5962-
None
, GND
4
Package styles for these parts are
8 and 16 pin DIP through hole
(case outlines P and E respec-
tively), 16 pin DIP flat pack (case
outline F), and leadless ceramic
chip carrier (case outline 2).
Devices may be purchased with a
variety of lead bend and plating
options. See Selection Guide
table for details. Standard
Military Drawing (SMD) parts are
available for each package and
lead style.
Because the same electrical die
(emitters and detectors) are used
Through Hole
8981002KPX
8981002KPC
8981002KYC
8981002KXA
8981002KPA
8981002KYA
Option #200
Option #100
Option #300
Option #600
HCPL-570K
8981001PX
8981001PC
8981001YC
8981001XA
HCPL-5700
HCPL-5701
8981001PA
8981001YA
8 pin DIP
Gold Plate
Available
Available
Available
Available
5962-
5962-
None
1
Through Hole
8978503KPX
8978503KPC
8978503KYC
8978503KPA
8978503KYA
8978503KZA
Option #200
Option #100
Option #300
Option #600
HCPL-573K
8978501PX
8978501PC
8978501YC
HCPL-5730
HCPL-5731
8978501PA
8978501YA
8978501ZA
8 pin DIP
Gold Plate
V
Available
Available
Available
Available
CC
5962-
5962-
, GND
2
2
for each channel of each device
listed in this data sheet, absolute
maximum ratings, recommended
operating conditions, electrical
specifications, and performance
characteristics shown in the
figures are similar for all parts
except as noted. Additionally, the
same package assembly processes
and materials are used in all
devices. These similarities justify
the use of a common data base
for die related reliability and
certain limited radiation test
results.
Unformed Leads
9800201KFX
9800201KFC
HCPL-675K
8302401FX
8302401FC
HCPL-6750
HCPL-6751
Flat Pack
Gold Plate
V
CC
16 pin
5962-
None
, GND
4
Surface Mount
8978504K2X
8978504K2A
HCPL-673K
HCPL-6730
HCPL-6731
Solder Pads
89785022X
89785022A
20 Pad
LCCC
5962-
5962-
None
2