6N135-020 HP [Agilent(Hewlett-Packard)], 6N135-020 Datasheet - Page 5

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6N135-020

Manufacturer Part Number
6N135-020
Description
Single Channel, High Speed Optocouplers
Manufacturer
HP [Agilent(Hewlett-Packard)]
Datasheet
8-Pin Widebody DIP Package with Gull Wing Surface Mount Option 300 (HCNW135/6,
HCNW4502/3)
Solder Reflow Temperature Profile
TEMPERATURE
ROOM
(0.070 ± 0.006)
1.78 ± 0.15
300
200
100
0
0
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
160°C
150°C
140°C
1
8
(0.442 ± 0.006)
11.15 ± 0.15
7
2
50
3°C + 1°C/–0.5°C
(0.100)
6
3
BSC
2.54
PREHEATING TIME
150°C, 90 + 30 SEC.
4
5
(0.061)
2.5°C ± 0.5°C/SEC.
MAX.
1.55
(0.354 ± 0.006)
(0.158)
100
9.00 ± 0.15
4.00
TIME (SECONDS)
MAX.
(0.030 ± 0.010)
0.75 ± 0.25
TEMP.
PEAK
245°C
LAND PATTERN RECOMMENDATION
150
SEC.
SEC.
30
30
(0.051)
1.3
(0.039 ± 0.006)
(0.484 ± 0.012)
50 SEC.
1.00 ± 0.15
12.30 ± 0.30
(0.433)
SOLDERING
11.00
200°C
TIME
200
MAX.
PEAK
TEMP.
240°C
TIGHT
TYPICAL
LOOSE
(0.09)
TEMP.
2.29
PEAK
230°C
5
7° NOM.
250
(0.534)
13.56
(0.010
0.254
+ 0.003)
- 0.0051
+ 0.076
- 0.002)

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