CLD-AP90 CREE [Cree, Inc], CLD-AP90 Datasheet - Page 4

• Manufacturer Part Number: CLD-AP90
• Manufacturer: CREE [Cree, Inc]

CirCuiT Board preparaTion & layouTS
Printed circuit boards (PCBs) should be prepared and/or cleaned according to the manufacturer’s specifications before
placing or soldering XLamp XB-D LeDs onto the PCB.
The diagram below shows the recommended PCB solder pad layout for XLamp XB-D LeDs.
CaSe TemperaTure (T
XLamp XB-D LeD case temperature (T
possible. This measurement point is shown in the picture below.
It is not required to use a solder footprint for the thermal pad that is larger than the XLamp XB-D LeD itself. In testing,
Cree has found such a solder pad to have insignificant impact on the resulting T
Copyright © 2012 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks
Copyright © 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks
of Cree, Inc. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at
of Cree, Inc.
www.cree.com.
C
B
A
0.28
Pad for thermocouple
2.45
0.36
0.36
0.36
RECOMMENDED PCB SOLDER PAD
6
Recommended PCB Solder Pad
S
) meaSuremenT poinT
0.92
2.34
0.46
0.82
s
) should be measured on the PCB surface, as close to the LeD’s thermal pad as
5
2.34
R1.086
0.284
0.284
0.284
RECOMMENDED STENCIL PATTERN
(HATCHED AREA IS OPENING)
0.426
Recommended Stencil Pattern
0.426
xlamp xB-D leD solDering & hanDling
0.65
0.852
2.272
4
s
measurement.
Thermocouple site
if no separate pad
1.136
THIRD ANGLE PROJECTION
All dimensions in mm.
0.462
2.272
0.923
3
MILLIMETERS AND AFTER F
TOLERANCE UNLESS SPE
UNLESS OTHERWISE SPE
FOR SHEET METAL PARTS
SURFACE FINISH:
DIMENSIONS ARE IN
4 4
.XX
.XXX ±
X°
.X
.XX
.XXX ±
X°
±
±
±
±
±
1.6
.25
.125
.5 °
.5 °
1.5
.75
.25
2