MICRF610TR MICREL [Micrel Semiconductor], MICRF610TR Datasheet - Page 17

• Manufacturer Part Number: MICRF610TR
• Description: 868-870 MHz ISM Band Transceiver Module
• Manufacturer: MICREL [Micrel Semiconductor]

Application Circuit Illustration
Figure 10. shows a typical set-up with the MICRF610, a
Low-Drop-Out voltage regulator (LDO)
controller (MCU). When the MICRF610 and the MCU runs
on the same power supply (min 2.0, max. 2.5V), the IO
can be connected directly to the MCU. If the MCU needs a
higher VDD than the max. specified VDD of the MICRF610
(2.5V), voltage dividers need to be added on the IO lines
not to override the max. input voltage.
Figure 11 shows a recommended voltage divider circuit for
a MCU running at 3.0V and the MICRF610 at 2.5V.
MICRF6xx
Figure 11. How to connect MICRF610 (2.5V) and MCU (3.0V)
Micrel, Inc.
December 2005
Figure 10. Circuit illustration of MICRF610, LDO and MCU
DATACLK
DATAIXO
RSSI
SCLK
LD
CS
IO
18k
18k
18k
3k3
3k3
3k3
15k
MCU
CS
SCLK
IO
DATAIXO
DATACLK
LD
RSSI
and a micro-
17
Assembling the MICRF610
Recommended Reflow Temperature Profile
When the MICRF610 module is being automatically
assembled to a PCB, care must be taken not to expose
the module for temperature above the maximum specified.
Figure 12 shows the recommended reflow temperature
profile.
Shock/Vibration during Reflow
The module has several components inside which are
assembled in a reflow process. These components may
reflow again when the module is assembled onto a PCB. It
is therefore important that the module is not subjected to
any mechanical shock or vibration during this process.
Handassembling the MICRF610
It is recommended to use solder paste also during hand
assembling of the module. Because of the module ground
pad on the bottom side, the module will be assembled
most efficient if the heat is being subjected to the bottom
side of the PCB. The heat will be transferred trough the
PCB due the ground vias under the module (see Layout
Considerations). In addition, it is recommended to use a
solder tip on the signal and power pads, to make sure the
solder points are properly melted.
Figure 12. Recommended Reflow Temperature Reflow
M9999-120205
MICRF610