SFM12-M FORMOSA [Formosa MS], SFM12-M Datasheet - Page 6

• Manufacturer Part Number: SFM12-M
• Description: Super fast recovery type
• Manufacturer: FORMOSA [Formosa MS]

PACKAGE
Suggested thermal profiles for soldering processes
SOD-123
Reel packing
Chip Silicon Rectifier
SFM11-M THRU SFM18-M
TL
25
TP
1.Storage environment: Temperature=5
2.Reflow soldering of surface-mount devices
http://www.formosams.com/
TEL:[phone]
FAX:[phone]
3.Reflow soldering
Tsmin
REEL SIZE
7"
Average ramp-up rate(T
Preheat
-Temperature Min(Tsmin)
-Temperature Max(Tsmax)
-Time(min to max)(t
Tsmax to T
-Ramp-upRate
Time maintained above:
-Temperature(T
-Time(t
Peak Temperature(T
Time within 5 C of actual Peak
Temperature(t
Ramp-down Rate
Time 25 C to Peak Temperature
Tsmax
REEL
(pcs)
2,500
L
o
)
Profile Feature
Preheat
t25 C to Peak
L
o
o
COMPONENT
tS
P
)
SPACING
L
(m/m)
)
4.0
s
)
P
)
Time
Ramp-up
L
to T
25,000
(pcs)
o
BOX
C
P
)
~40
o
C
183*183*123
Page 6
Humidity=55%±25%
INNER
(m/m)
BOX
Tp
Ramp-down
(m/m)
REEL
DIA,
178
TL
Soldering Condition
255 C-0/+5 C
60~260sec
<3
60~120sec
<6 C/sec
10~30sec
<6minutes
382*262*387
<3 C/sec
o
150 C
200 C
CARTON
o
217 C
o
C
(m/m)
o
SIZE
/sec
o
o
o
Critical Zone
Document ID
DS-121401
TL to TP
o
Formosa MS
CARTON
Issued Date
2008/02/10
200,000
(pcs)
Revised Date
2010/03/10
GROSS WEIGHT
APPROX.
Revision
(kg)
D
9.5
Page.
7