MIC5209 MICREL [Micrel Semiconductor], MIC5209 Datasheet - Page 10

• Manufacturer Part Number: MIC5209
• Description: 500mA Low-Noise LDO Regulator
• Manufacturer: MICREL [Micrel Semiconductor]

MIC5209
the MIC5209 is calculated using the voltage drop across the
device output current plus supply voltage ground current.
Considering worst case tolerances, the power dissipation
could be as high as:
Using the maximum junction temperature of 125 C and a
of 8 C/W for the SOT-223, 25 C/W for the SO-8, or 2 C/W for
the TO-263 package, the following worst-case heat-sink
thermal resistance (
MIC5209
T
JA
SA
SA
SA
A
Table 2. Maximum Allowable Thermal Resistance
(limit)
SOT-223
SO-8
TO-263-5
(V
[(3.6V – 2.375V)
P
D
SA
JA
IN(max)
= 407mW
T
JA
– V
J(max)
209 C/W
201 C/W
184 C/W
207 C/W
40 C
OUT(max)
P
D
SA
JC
) requirements are:
320mA] + (3.6V
T
A
)
184 C/W
176 C/W
159 C/W
182 C/W
50 C
I
OUT
+ V
160 C/W
152 C/W
135 C/W
158 C/W
IN(max)
60 C
4mA)
I
GND
123 C/W
115 C/W
121 C/W
98 C/W
75 C
JC
10
Table 2 and Figure 6 show that the Slot-1 power supply
application can be implemented with a minimum footprint
layout. Figure 6 shows the necessary copper pad area to
obtain specific heat sink thermal resistance (
copper, according to Figure 6, and can easily be accom-
plished with the minimum footprint.
SA
values in Table 2 require much less than 500mm
Figure 6. PCB Heat Sink Thermal Resistance
70
60
50
40
30
20
10
0
0
COPPER HEAT SINK AREA (mm
2000
4000
6000
2
)
SA
August 2, 2000
) values. The
Micrel
2
of