STV-376-E01 STMICROELECTRONICS [STMicroelectronics], STV-376-E01 Datasheet - Page 28

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STV-376-E01

Manufacturer Part Number
STV-376-E01
Description
Ultra-low power laser motion sensor for laser mouse applications
Manufacturer
STMICROELECTRONICS [STMicroelectronics]
Datasheet
Package mechanical data
Note:
10.1
28/30
2
3
1
Table 10.
Surface finish W1 is 0.07 Ra.
Ejectors are on 5.2 mm square for both top and bottom package.
On top package, only the pin 1 identification is not an engraved ejector.
TQFP package guidelines
The IC can be exposed a maximum of two times to an IR/Convection reflow solder process
having a temperature profile peak of no higher than 240 ° C.
The package/chip are lead free and is ROHS compliant.
For full handling guidelines please contact ST (document reference 7310263).
Reference
W1
W2
D1
D3
A1
A2
E1
E3
L1
A
B
D
E
e
L
c
k
TQFP dimensions (mm)
Minimum (mm)
0.050
1.350
0.300
0.090
0.450
0d
Typical (mm)
0.370
9.000
7.000
5.600
0.800
9.000
7.000
5.600
0.600
1.000
5.000
0.650
1.400
3.5d
Maximum (mm)
1.600
0.150
1.450
0.450
0.200
0.750
7d
VT5376

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