ql16x24b QuickLogic Corp, ql16x24b Datasheet - Page 4

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ql16x24b

Manufacturer Part Number
ql16x24b
Description
Military Fpga Combining High Performance And High Density
Manufacturer
QuickLogic Corp
Datasheet

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Military Temperature Plastic Process Flow
8-4
4
AC, DC, Functional Testing, and
In-Process Wafer Electrical Test
Detailed Inspection points, bond
Group A, Sub-group 1 Electrical
pull, die shear, and QCI Gates.
Sample test 116 units, LTPD 2
from -55
DC, Functional, and AC Tests
performed. Test columns and
Characterized and correlated
Military Temperature Plastic
Final Lot Traceable Marking
Final Electrical Test at 25
test fuses are used to verify
Wafer Sort Electrical Test
test columns to verify
o
Assembly Operation
C to + 125
Wafer Fabrication
QuickLogic Military FPGA Introduction
Programmability
programmability
o
Process Flow
C. 100%
o
M
C
ILITARY
P
Preliminary
ROCESS
T
EMPERATURE
F
LOW
P
LASTIC
Visual Mechanical Inspection
Quality Assurance Inspection
-Electrical at 25
-Visual Mechanical
Military Reliability Monitor
Testing. HTOL hot and cold
Finished Goods Inventory
Pack Operation
Pack Inspection and Plant
Clearance. Database monitor,
hot and cold
Ship to Customer
Customer Logic Function
Programming
Program Monitor
o
C and 70
o
C

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