UPD72042BGT NEC [NEC], UPD72042BGT Datasheet - Page 87

• Manufacturer Part Number: UPD72042BGT
• Description: LSI DEVICE FOR Inter Equipment Bus (IEBus) PROTOCOL CONTROL
• Manufacturer: NEC [NEC]

9. RECOMMENDED SOLDERING CONDITIONS
processes are used, or if the soldering is performed under different conditions, please make sure to consult with our
sales offices.
(C10535E).
Surface mount devices
PD72042BGT: 16-pin plastic SOP (9.53 mm (375))
Infrared ray reflow
VPS
Wave soldering
Partial heating method
When soldering this product, it is highly recommended to observe the conditions as shown below. If other soldering
For more details, refer to our document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL”
Caution Apply only one kind of soldering condition to a device, except for “partial heating method”, or
Process
the device will be damaged by heat stress.
Peak temperature: 235 C or below (Package surface temperature),
Reflow time: 30 seconds or less (at 210 C or higher),
Maximum number of reflow processes: 2 times.
Peak temperature: 215 C or below (Package surface temperature),
Reflow time: 40 seconds or less (at 200 C or higher),
Maximum number of reflow processes: 2 times.
Solder temperature: 260 C or below, Flow time: 10 seconds or less,
Maximum number of flow processes: 1 time,
Pre-heating temperature: 120 C or below (Package surface temperature).
Pin temperature: 300 C or below,
Heat time: 3 seconds or less (Per each side of the device).
Data Sheet S13990EJ3V0DS
Conditions
PD72042B
IR35-00-2
VP15-00-2
WS60-00-1
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