B32669B6105J000 EPCOS [EPCOS], B32669B6105J000 Datasheet - Page 11

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B32669B6105J000

Manufacturer Part Number
B32669B6105J000
Description
Metallized Polypropylene Film Capacitors (MKP)
Manufacturer
EPCOS [EPCOS]
Datasheet
B32669
AC applications (wound)
3
Embedding of capacitors in finished assemblies
In many applications, finished circuit assemblies are embedded in plastic resins. In this case,
both chemical and thermal influences of the embedding ("potting") and curing processes must be
taken into account.
Our experience has shown that the following potting materials can be recommended: non-flexible
epoxy resins with acid-anhydride hardeners; chemically inert, non-conducting fillers; maximum
curing temperature of 100 C.
Caution:
Consult us first if you wish to embed uncoated types!
Please read Cautions and warnings and
Page 11 of 17
Important notes at the end of this document.

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