UPD30500 NEC [NEC], UPD30500 Datasheet - Page 29

no-image

UPD30500

Manufacturer Part Number
UPD30500
Description
VR5000TM, VR5000ATM, VR5000BTM 64-BIT MICROPROCESSOR
Manufacturer
NEC [NEC]
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
UPD30500RJ-200
Manufacturer:
NEC
Quantity:
20 000
Part Number:
UPD30500S2-200
Manufacturer:
NEC
Quantity:
20 000
4. RECOMMENDED SOLDERING CONDITIONS
Mounting Technology Manual (C10535E).
(1) Soldering Conditions of Surface Mount Type
Notes 1. Under development
(2) Soldering Conditions of Insertion Type
Caution Wave soldering is only for the lead part in order that jet solder cannot contact with the chip directly.
Caution Do not use two or more soldering methods in combination (except partial heating).
PD30500S2-150:
PD30500S2-180:
PD30500S2-200:
PD30500AS2-250:
PD30500BS2-300
PD30500RJ-150: 223-pin ceramic PGA (48
PD30500RJ-180: 223-pin ceramic PGA (48
PD30500RJ-200: 223-pin ceramic PGA (48
Infrared reflow
VPS
Partial heating
Wave soldering
(Pin only)
Partial heating
Soldering Method
Soldering Method
Soldering this product under the following soldering conditions is recommended.
For the details of the recommended soldering conditions, refer to Information Document Semiconductor Device
For the soldering methods and recommended other than those recommended, consult NEC.
2. Number of days in storage after the dry pack has been opened. The storage conditions are at 25 C, 65% RH
MAX.
Note 1
Package peak temperature: 235 C, Time: 30 sec max. (210 C min.),
Number of times: 3 times max., Number of days: 3
necessary at 125 C for 10 hours)
Package peak temperature: 215 C, Time: 25 to 40 sec max. (200 C min.),
Number of times: 3 times max., Number of days: 3
necessary at 125 C for 10 hours)
Pin temperature: 300 C max., Time: 3 sec max. (per device side)
Solder bath temperature: 260 C max., Time: 10 sec max.
Pin temperature: 300 C max., Time: 3 sec max. (per pin)
: 272-pin plastic BGA (C/D advanced type) (29
272-pin plastic BGA (C/D advanced type) (29
272-pin plastic BGA (C/D advanced type) (29
272-pin plastic BGA (C/D advanced type) (29
272-pin plastic BGA (C/D advanced type) (29
Data Sheet U12031EJ4V0DS00
Soldering Conditions
48)
48)
48)
Soldering Conditions
Note 2
Note 2
PD30500, 30500A, 30500B
(after that, prebaking is
(after that, prebaking is
29)
29)
29)
29)
29)
IR35-103-3
VP15-103-3
Conditions Symbol
Recommended
29

Related parts for UPD30500