74AHCU04D,118 NXP Semiconductors, 74AHCU04D,118 Datasheet
74AHCU04D,118
Specifications of 74AHCU04D,118
74AHCU04D-T
935263042118
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74AHCU04D,118 Summary of contents
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Hex inverter Rev. 03 — 14 November 2007 1. General description The 74AHCU04 is high-speed Si-gate CMOS devices and is pin compatible with low power Schottky TTL (LSTTL specified in compliance with JEDEC standard No. 7A. The ...
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... NXP Semiconductors 4. Functional diagram mna342 Fig 1. Logic symbol 5. Pinning information GND 7 001aac441 Fig 4. Pin configuration SO14 and TSSOP14 5.1 Pin description Table 2. Pin description Symbol Pin 74AHCU04_3 Product data sheet mna343 Fig 2. IEC logic symbol terminal 1 index area (1) The die substrate is attached to the exposed die pad using conductive die attach material ...
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... NXP Semiconductors Table 2. Pin description …continued Symbol Pin GND Functional description Table 3. Function table H = HIGH voltage level LOW voltage level Input Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter V supply voltage CC I input clamping current ...
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... NXP Semiconductors 8. Recommended operating conditions Table 5. Recommended operating conditions Voltages are referenced to GND (ground = 0 V). Symbol Parameter V supply voltage CC V input voltage I V output voltage O T ambient temperature amb t/ V input transition rise and fall rate 9. Static characteristics Table 6. Static characteristics Voltages are referenced to GND (ground = 0 V) ...
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... NXP Semiconductors 10. Dynamic characteristics Table 7. Dynamic characteristics GND = 0 V; For test circuit see Figure Symbol Parameter Conditions t propagation nA to nY; see pd delay power pF dissipation V = GND capacitance [ the same as t and PLH PHL [2] Typical values are measured [3] Typical values are measured at V ...
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... NXP Semiconductors 12. Typical transfer characteristics ( amb Fig 2 ( amb Fig 10 5 74AHCU04_3 Product data sheet mna353 700 (V) 500 3 300 2 100 1 0 100 amb Fig mna351 (mA kHz ( kHz Fig 11. Test set-up for measuring forward transconductance Rev. 03 — 14 November 2007 74AHCU04 ...
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... NXP Semiconductors (mA/ amb Fig 12. Typical forward transconductance as a function of the supply voltage 13. Application information Some applications are: • Linear amplifier (see • In crystal oscillator design (see Remark: All values given are typical unless otherwise specified U04 Maximum 1.5 V centered at ...
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... NXP Semiconductors Table 8. External components for resonator (f < 1 MHz) All values given are typical and must be used as an initial set-up. Frequency 10 kHz to 15.9 kHz 16 kHz to 24.9 kHz 25 kHz to 54.9 kHz 55 kHz to 129.9 kHz 130 kHz to 199.9 kHz 200 kHz to 349.9 kHz 350 kHz to 600 kHz Table 9 ...
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... NXP Semiconductors 14. Package outline SO14: plastic small outline package; 14 leads; body width 3 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.25 1.45 mm 1.75 0.25 0.10 1.25 0.010 0.057 inches 0.069 0.01 0.004 0.049 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. ...
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... NXP Semiconductors TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT max. 0.15 0.95 mm 1.1 0.25 0.05 0.80 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. ...
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... NXP Semiconductors DHVQFN14: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 14 terminals; body 2 0.85 mm terminal 1 index area terminal 1 index area DIMENSIONS (mm are the original dimensions) (1) A (1) UNIT max. 0.05 0.30 3 0.2 0.00 0.18 2.9 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. ...
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... Document ID Release date 74AHCU04_3 20071114 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Section • Section • ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 19. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 5 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 5.1 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2 6 Functional description . . . . . . . . . . . . . . . . . . . 3 7 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 5 11 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 12 Typical transfer characteristics . . . . . . . . . . . . 6 13 Application information Package outline ...