lp62s16128b-m AMIC Technology Corporation, lp62s16128b-m Datasheet - Page 14

• Manufacturer Part Number: lp62s16128b-m
• Description: 128k X 16 Bit Low Voltage Cmos Sram
• Manufacturer: AMIC Technology Corporation

Package Information
48LD CSP (6 x 8 mm) Outline Dimensions
(48TFBGA)
(March, 2007, Version 1.0)
Note:
1. THE BALL DIAMETER, BALL PITCH, STAND-OFF & PACKAGE THICKNESS
2. PRIMARY DATUM C AND SEATING PLANE ARE DEFINED BY THE SPHERICAL CROWNS
3. DIMENSION b IS MEASURED AT THE MAXIMUM.
4. BALL PAD OPENING OF SUBSTRATE IS Φ 0.3mm (SMD)
G
A
B
C
D
E
F
H
C
ARE DIFFERENT FROM JEDEC SPEC MO192 (LOW PROFILE BGA FAMILY).
THERE SHALL BE A MINIMUM CLEARANCE OF 0.25mm BETWEEN THE EDGE OF THE
SOLDER BALL AND THE BODY EDGE.
OF THE SOLDER BALLS.
SUGGEST TO DESIGN THE PCB LAND SIZE AS Φ 0.3mm (NSMD)
Ball*A1 CORNER
SEATING PLANE
1 2 3 4 5 6
SIDE VIEW
TOP VIEW
Symbol
A
A
E
D
A
D
E
e
b
1
2
1
1
MIN.
1.00
0.20
0.48
5.90
7.90
0.30
Dimensions in mm
---
---
---
13
NOM.
1.10
0.25
0.53
6.00
8.00
3.75
5.25
0.75
0.35
B
0.20(4X)
A
MAX.
1.20
0.30
0.58
6.10
8.10
0.40
---
---
---
6
0.10
0.25
BOTTOM VIEW
5
S
S
4
b (48X)
D
LP62S16128B-M Series
D
e
C
C
1
3
Ball#A1 CORNER
A B
AMIC Technology, Corp.
2
1
A
B
C
D
E
G
H
F
unit: mm