BB1110RC13 BITECH [Bi technologies], BB1110RC13 Datasheet
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BB1110RC13
Manufacturer Part Number
BB1110RC13
Description
Resistor capacitor network Thick film resistors Ceramic chip capacitors
Manufacturer
BITECH [Bi technologies]
Datasheet
1.BB1110RC13.pdf
(2 pages)
MODEL BB1110RC
MODEL BB1110RC
MODEL BB1110RC
MODEL BB1110RC
Resistor capacitor network
Thick film resistors
Ceramic chip capacitors
DISCRIPTION
DISCRIPTION
DISCRIPTION
DISCRIPTION
Model BB1110RC is designed for terminating high-speed memory buses. Ideally suited for local
decoupling of data line drivers. These specialty networks employ solder balls for surface mount flip
chip attachment. Their unique construction yields extremely low capacitance and inductance
parasitics critical for these high-speed applications.
FEATURES
FEATURES
FEATURES
FEATURES
SCHEMATIC
SCHEMATIC
SCHEMATIC
SCHEMATIC
ELECTRICAL
ELECTRICAL
ELECTRICAL
ELECTRICAL
Resistance Tolerance
Capacitance Tolerance
Capacitor Type
Capacitor Maximum Voltage
TCR
Operating Temperature Range
Maximum Resistor Power
Package Power Rating
1
BI Technologies Corporation
4200 Bonita Place, Fullerton, CA 92835 USA
Phone: 714 447 2345
August 30, 2005
Specifications subject to change without notice.
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Integrated resistor and capacitor network
High density packaging
High temperature solder balls
Industry standard ball diameter and pitch
Excellent high frequency performance
1 1 1 1
Website:
www.bitechnologies.com
page 1 of 2
C1-9 = 0.1uF
R1-9 = 50
BI technologies
0.05 watts at 70°C
1.0 watt @ 70°C
-55°C to +85°C
200 ppm/°C
10 volts
± 10%
± 1%
X5R
Related parts for BB1110RC13
BB1110RC13 Summary of contents
Page 1
MODEL BB1110RC MODEL BB1110RC MODEL BB1110RC MODEL BB1110RC Resistor capacitor network Thick film resistors Ceramic chip capacitors DISCRIPTION DISCRIPTION DISCRIPTION DISCRIPTION Model BB1110RC is designed for terminating high-speed memory buses. Ideally suited for local decoupling of data line drivers. These ...
Page 2
MECHANICAL MECHANICAL MECHANICAL MECHANICAL Solder Ball Finish Solder Ball Co-planarity Substrate Material Resistor Material ORDERING INFORMATION ORDERING INFORMATION ORDERING INFORMATION ORDERING INFORMATION Model Series Channels: 9 Solder ball Pitch: 1.0 mm PACKING INFORMATION PACKING INFORMATION PACKING ...