MADP-04 MA-COM [M/A-COM Technology Solutions, Inc.], MADP-04 Datasheet

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MADP-04

Manufacturer Part Number
MADP-04
Description
PIN Diodes for Microwave Switch Designs
Manufacturer
MA-COM [M/A-COM Technology Solutions, Inc.]
Datasheet

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1
PIN Diodes for Microwave Switch Designs
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
AN3021
Introduction
This Application Note is intended to provide practical guidance in the selection of PIN Diodes for switch control
circuit functions. Switches, Digital and Analog Attenuators, and Limiters each have unique functions that require
proper device selection. The design difficulty lies within the parametric translation from Diode Specifications, to
the circuit designers’ Microwave Specifications. Diode parametric language such as Vb, Vf, Ct, Rs,
convert into Insertion Loss, VSWR, Isolation, P1dB, Input IP3, RF Operating Power, RF Power Dissipation, and
D.C. Power Consumption Specification Terminology.
In addition to actual diode parameters, package parasitics play a significant role in determining switch circuit per-
formance. Package capacitance, package inductance, package electrical resistance, and package thermal im-
pedance are extremely important considerations to determine the effective frequency bandwidth and maximum
incident power for reliable switch operation.
The manufacturing methodology dictates the type of diode selection. Surface mount assembly will mandate the
usage of either plastic, HMIC SURMOUNT, or MELF & HiPAX ceramic devices. Chip and Wire ( Hybrid ) manu-
facturing will determine the usage of Cermachips, Flip Chips, or Beam Lead Devices. Schematics for the most
common switch designs: Series-Exclusive, Shunt-Exclusive, and Series-Shunt are outlined below for considera-
tion.
The Decision Making Process for PIN Diode Selection for Microwave Switch Design
The following procedure outlines and Effective Process for PIN Diode Selection for Switch Design.
1. Determine the Preferred Type of Manufacturing for the PIN Diode in the Switch Design: Surface
2. Determine the Frequency of Operation and RF Power Handling of the Switch Design.
3. Use Table 1, “Relative Switch Performance and Design Evaluation Matrix” to determine the Type of
4. Use Table 2, “Relative PIN Diode Performance Evaluation Matrix” to Determine the Type of PIN Di-
5. Use Table 3, “PIN Diode P/N Series Matrix” to Determine the PIN Diode P/N Series that Best Satis-
Mount or Chip and Wire (Hybrid) Manufacturing.
Switch Design that Best Satisfies the Particular Switch Specifications and Requirements.
ode that Best Satisfies the Switch Design Selected from Table 1.
fies the Type of PIN Diode Selected from Table 2.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.43537383
Visit www.macomtech.com for additional data sheets and product information.
• China Tel: +86.21.2407.1588
τ
L
,
θ, must
Rev. V2

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MADP-04 Summary of contents

Page 1

AN3021 PIN Diodes for Microwave Switch Designs Introduction This Application Note is intended to provide practical guidance in the selection of PIN Diodes for switch control circuit functions. Switches, Digital and Analog Attenuators, and Limiters each have unique functions that ...

Page 2

AN3021 PIN Diodes for Microwave Switch Designs Table 1: Relative Switch Performance and Design Evaluation Matrix Parameter Insertion Loss VSWR Isolation P1dB Input IP3 RF Incident Power RF Power Dissipation Switching Speed D.C. Power Consumption PIN Diode Driver Design Simplicity ...

Page 3

AN3021 PIN Diodes for Microwave Switch Designs Table 2: Relative PIN Diode Performance Evaluation Matrix Surface Mount Assembly Key Parameter Plastic 1 MHz < F < 1 GHz 100 MHz < F < 4 GHz Best Selection 4 GHz < ...

Page 4

... Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. SURMOUNT PIN Cermachip PIN Diodes Diodes Part Numbers: Part Numbers: MA4SPS Series MA4P102 MADP-042XXX MA4P202, 203 Series MA4P303 MA4P404 MA4P504 MA4P505 MA4P604 MA4P606 MA4PK2000, 3000 • ...

Page 5

AN3021 PIN Diodes for Microwave Switch Designs Schematic 1: SP2T Series Exclusive PIN Diode Switch Isolation with +5 V Supply +5V SN5406 1K Open Collector + 5V TTL Driver J3 Forward Bias Diode Voltage, Δ ...

Page 6

AN3021 PIN Diodes for Microwave Switch Designs Schematic 2: SP2T All Shunt Isolation Design with 90° Transformer using Distributed Transmission Line J3 θ = 90° θ ° = β π / ...

Page 7

AN3021 PIN Diodes for Microwave Switch Designs Schematic 3: SP2T All Shunt Isolation Design using Transformer Schematic 3: D.C. Bias to RF Truth Tabl RF State Low Loss J1-J2 & Isolation J1-J3 Low Loss J1-J3 ...

Page 8

AN3021 PIN Diodes for Microwave Switch Designs Schematic 4: SP2T Series-Shunt Isolation Design with Positive & Negative Bias Current B2 J2 Shunt Diode Schematic 4: D.C. Bias to RF Truth Table RF State Low Loss J1-J2 & Isolation ...

Page 9

AN3021 PIN Diodes for Microwave Switch Designs Schematic 5: SP2T Series-Shunt Isolation Design with +5 V Supply +5V +5V 330 Ω SN7406 Open Collector + 5V TTL Driver J3 +5V +5V 330 Ω SN7406 Open Collector + 5V ...

Page 10

AN3021 PIN Diodes for Microwave Switch Designs Schematic 6: TR Switch Schematic with 25 dB Isolation Design with +3 V Supply Tx B1 Bias Schematic 6: TR Switch D.C. Bias to RF Truth Table RF State Low Loss Tx - ...

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