MADP-017015-1314 MA-COM [M/A-COM Technology Solutions, Inc.], MADP-017015-1314 Datasheet - Page 4

• Manufacturer Part Number: MADP-017015-1314
• Manufacturer: MA-COM [M/A-COM Technology Solutions, Inc.]

4
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
SURMOUNT™ 15µM PIN Diodes
RoHS Compliant
All semiconductor chips should be handled with care to avoid damage or contamination from perspiration and skin oils. The
use of plastic tipped tweezers or vacuum pickups is strongly recommended for individual components. Bulk handling should
insure that abrasion and mechanical shock are minimized.
Attachment to a circuit board is made simple through the use of surface mount technology. Mounting pads are conveniently
located on the bottom surface of these devices and are removed from the active junction locations. These devices are well
suited for solder attachment onto hard and soft substrates. The use of 80Au/20Sn, or RoHS compliant solders is
recommended. For applications where the average power is ~1W, conductive silver epoxy may also be used. Cure per
manufacturers recommended time and temperature. Typically 1 hour at 150°C.
When soldering these devices to a hard substrate, hot gas die bonding is preferred. A vacuum tip pick-up tool and a force of
60 to100 grams applied to the top surface of the device is recommended. When soldering to soft substrates, such as Duroid, it
is recommended to use a soft solder at the circuit board to mounting pad interface. Position the die so that its mounting pads
are aligned with the circuit board mounting pads. While applying a downward force perpendicular to the top surface of the die,
apply heat near the circuit trace and diode mounting pad. The solder connection to the two pads should not be made one at a
time as this will create unequal heat flow and thermal stress to the part. Solder reflow should not be performed by causing heat
to flow through the top surface of the die to the back. Since the HMIC glass is transparent, the edges of the mounting pads
can be visually inspected through the die after attachment is completed.
Typical re-flow profiles for Sn60/Pb40 and RoHS compliant solders is provided in
Instructions“ and can viewed on the MA-COM website @
MADP-017015-1314
MADP-030015-1314
MADP-017015-13140G
MADP-030015-13140G
MADP-017015-13140P
MADP-030015-13140P
Part Number
Ordering Information
Handling Procedures
Bonding Techniques
www.macomtech.com
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
100 piece gel pack
100 piece gel pack
• North America Tel: [phone] / Fax: [phone]
• Europe Tel: [phone] / Fax: [phone]
• Asia/Pacific Tel: [phone] / Fax: [phone]
3000 piece reel
3000 piece reel
Visit www.macomtech.com for additional data sheets and product information.
Package
Application Note M538
, “Surface Mounting
Rev. V5