sna-300 Sirenza Microdevices, sna-300 Datasheet - Page 3
![no-image](/images/manufacturer_photos/0/6/613/sirenza_microdevices_sml.jpg)
sna-300
Manufacturer Part Number
sna-300
Description
Dc-3 Ghz, Cascadable Gaas Hbt Mmic Amplifier
Manufacturer
Sirenza Microdevices
Datasheet
1.SNA-300.pdf
(3 pages)
303 South Technology Court
Broomfield, CO 80021
RF in
For recommended handling, die attach, and bonding methods, see the following application note at
R
Typical Application Circuit
(above configuration used for S-parameter data)
BIAS
Caution: ESD sensitive
Appropriate precautions in handling, packaging
and testing devices must be observed.
Suggested Bonding Arrangement
1 uF
C
B
1000
pF
1
SNA-300
4
2
C
D
3
AN-041 (PDF) Handling of Unpackaged Die
L
C
C
B
Phone: (800) SMI-MMIC
www.sirenza.com.
RF out
SNA-300 DC-3 GHz Cascadable MMIC Amplifier
3
Designator
Reference
Supply Voltage(V
Recommended Bias Resistor Values for I
Note: R
C
C
L
Application Circuit Element Values
C
B
D
RFIN
R
BIAS
BIAS
220 pF
100 pF
68 nH
provides DC bias stability over temperature.
GND
VIA
Part Number Ordering Information
500
Simplified Schematic of MMIC
RFOUT
Part Number
SNA-300
S
R
)
BIAS
100 pF
68 pF
33 nH
850
=( V
5 V
36
Frequency (Mhz)
S
-V
68 pF
22 pF
22 nH
D
1950
) / I
68
6 V
Die Thickness - 0.004 [0.1]
Dimensions - inches [mm]
100 pcs. per pack
D
http://www.sirenza.com
Gel Pack
56 pF
22 pF
18 nH
120
2400
8 V
Preliminary
D
=35mA
EDS-102432 Rev D
180
39 pF
10 V
15 pF
15 nH
3500