hsmp-3830 Avago Technologies, hsmp-3830 Datasheet - Page 6

• Manufacturer Part Number: hsmp-3830
• Description: Surface Mount Rf Pin Diodes
• Manufacturer: Avago Technologies

Package Dimensions
Outline 23 (SOT-23)
Package Characteristics
Lead Material .............................................................................................................................Alloy 42
Lead Finish ..........................................................................................Tin 100% (Lead-free option)
Maximum Soldering Temperature ............................................................. 260°C for 5 seconds
Minimum Lead Strength . ........................................................................................... 2 pounds pull
Typical Package Inductance ....................................................................................................... 2 nH
Typical Package Capacitance ...............................................................0.08 pF (opposite leads)
Profile Option Descriptions
-BLKG = Bulk
-TR1G = 3K pc. Tape and Reel, Device Orientation; See Figure 13
-TR2G = 10K pc. Tape and Reel, Device Orientation; See Figure 13
Tape and Reeling conforms to Electronic Industries RS-481, “Taping of Surface
Mounted Components for Automated Placement. ”
Ordering Information
Specify part number followed by option. For example:
HSMP - 383x - XXX
6
E
A1
Notes:
XXX-package marking
Drawings are not to scale
e2
e
XXX
D
e1
B
E1
A
Bulk or Tape and Reel Option
Part Number
Surface Mount PIN Diode
SYMBOL
A1
E1
e1
e2
A
B
C
D
e
E
L
DIMENSIONS (mm)
MIN.
0.000
0.086
0.79
0.37
2.73
1.15
0.89
1.78
0.45
2.10
0.45
C
MAX.
0.100
0.152
1.20
0.54
3.13
1.50
1.02
2.04
0.60
2.70
0.69
L
Recommended PCB Pad Layout
for Avago’s SOT-23 Products
0.039
0.035
1
0.9
Dimensions in inches
0.031
0.8
0.039
mm
1
0.079
2.0