cxa3222n Sony Electronics, cxa3222n Datasheet
cxa3222n
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cxa3222n Summary of contents
Page 1
... TX Gain Control Amplifier For the availability of this product, please contact the sales office. Description CXA3222N gain control amplifier suitable for CDMA cellular/PCS phone. Features • Wide gain control range • Linear gain slope • Wideband operation (50MHz to 300MHz) • Very small package (8 Pin SSOP) • ...
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... Block Diagram CDMA IN IF Input CDMA INX Gain control GCTL Supply Voltage V CC Ground GND Power Save PSV Pin Configuration CDMA IN CDMA INX Bias Driver 8 GCTL OUT 6 GND 3 OUTX 5 PSV 4 – 2 – CXA3222N OUT IF Output OUTX CC ...
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... GND GND – 3 – CXA3222N Description Differential input pins for CDMA transmit IF signal. Ground. Power save function pin. High: Active Low: Power save 2 Differential output pins for transmit IF signal. Open collector output. Positive power supply. ...
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... Vgctl = 0.5V Pin 4 Pin 4 Conditions f = 130.38MHz, level = –22.5dBm, Vgctl = 2.3V Vgctl = 1.5V Vgctl = 1.0V Vgctl = 0.7V Gain at Vgctl = 2.0V – Gain at Vgctl = 1. 15dB f1 = 129.38MHz 131.38MHz Measure of 130.38MHz 15dB Measure of 130.38MHz – 4 – CXA3222N (V = 3.0V 27°C) CC Min. Typ. Max. Unit 15 –15 µA 1 – ...
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... OUTX 5 1 TOKO, Inc. B5FL 616DS-1135 2 Coilcraft, Inc. 1008HS-102TKBC 3 Coilcraft, Inc. 1008HS-821TKBC 1 CDMA IN GCTL 8 2 CDMA INX GND OUT 6 4 PSV OUTX 5 – 5 – CXA3222N V16 1k A8 0.01µ 0.01µ 1 OUTPUT 1µ 2. 0.01µ Gain Control Voltage 1k 100p 0.01µ 1000p ...
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... This IC assumes the excellent characteristics when the differential input impedance between Pins 1 and 2 is 500 . Refer to the Measurement Circuit for the external element settings, etc. 4) Pay attention to handling this IC because its electrostatic discharge strength is weak. Conditions f = 130.38MHz, Vgctl = 1.5V – 6 – CXA3222N (V = 3.0V 27°C) CC Typ. Unit ...
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... Gain Error from Room Temp 6 = 3. –2 –4 –6 –80 – – 7 – CXA3222N IIP3 –40° 27° 85°C – Power gain [dB 3. –40° 85°C –40 – ...
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... SONY CODE SSOP008-P-0044 EIAJ CODE JEDEC CODE 8PIN SSOP (PLASTIC 0.65 0.13 M 0.1 ± 0.05 DETAIL B PACKAGE STRUCTURE PACKAGE MATERIAL LEAD TREATMENT LEAD MATERIAL PACKAGE MASS – 8 – CXA3222N + 0.2 1.25 – 0.1 0.1 0.25 0° to 10° DETAIL A EPOXY RESIN SOLDER / PALLADIUM PLATING COPPER ALLOY 0.04g ...