cxa3222an Sony Electronics, cxa3222an Datasheet
cxa3222an
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cxa3222an Summary of contents
Page 1
... TX Gain Control Amplifier Description CXA3222AN gain control amplifier suitable for CDMA cellular/PCS phone. Features • Wide gain control range • Linear gain slope • Wideband operation (50 MHz to 300 MHz) • Very small package (8 Pin SSOP) • Low voltage operation • High output IP3 • ...
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... Block Diagram CDMA IN IF Input CDMA INX Gain control Supply Voltage Ground Power Save Pin Configuration GCTL V CC Bias Driver GND PSV CDMA IN 1 CDMA INX 2 GND 3 PSV 4 —2— OUT IF Output OUTX 8 GCTL OUT 6 5 OUTX CXA3222AN ...
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... GND —3— Description V CC Differential input pins for CDMA transmit IF signal. GND Ground. CC Power save function pin. High: Active Low: Power save V CC Differential output pins for transmit IF signal. Open collector output. GND Positive power supply. CC Gain control pin. CXA3222AN ...
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... Pin 4 Conditions f=130.38 MHz, level=–22.5 dBm, Vgctl=2.3 V Vgctl=1.5 V Vgctl=1.0 V Vgctl=0.7 V Gain at Vgctl=2.0 V – Gain at Vgctl=1 f1=129.38 MHz, f2=131.38 MHz Measure of 130.38 MHz G= Measure of 130.38 MHz —4— CXA3222AN (V =3.0 V, Ta=27 °C) CC Min. Typ. Max. Unit 10 15.7 21 –15 µ ...
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... GCTL 8 2 CDMA INX GND OUT 6 4 PSV OUTX 5 —5— V16 10k A8 0.01µ 0.01µ 1 OUTPUT 2.4k TOKO, Inc. B5FL 616DS-1135 Coilcraft, Inc. 1008HS-102TKBC Coilcraft, Inc. 1008HS-821TKBC V CC 0.01µ Gain Control Voltage 1k 100p 0.01µ 1000p TX IF OUTPUT 1000p CXA3222AN ...
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... This IC assumes the excellent characteristics when the differential input impedance between Pins 1 and 2 is 500 . Refer to the Measurement Circuit for the external element settings, etc. 4) Pay attention to handling this IC because its electrostatic discharge strength is weak. Conditions f=130.38 MHz, Vgctl=1.5 V —6— CXA3222AN (V =3.0 V, Ta=27 °C) CC Typ. Unit ...
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... 3. –2 –4 –6 – —7— CXA3222AN IIP3 –40° 27° 85°C –40 – Power gain [dB] Gain Error from Room Temp –40° 85°C –60 –40 –20 ...
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... LEAD PLATING SPECIFICATIONS ITEM SPEC. LEAD MATERIAL COPPER ALLOY SOLDER COMPOSITION Sn-Bi Bi:1-4wt% PLATING THICKNESS 5-18 m —8— + 0.2 1.25 – 0.1 0.1 + 0.08 b=0.24 – 0.07 (0.22) DETAIL B : SOLDER EPOXY RESIN SOLDER PLATING COPPER ALLOY 0.04g + 0.2 1.25 – 0.1 0.1 + 0.08 b=0.24 – 0.07 (0.22) DETAIL B : SOLDER EPOXY RESIN SOLDER PLATING COPPER ALLOY 0.04g Sony Corporation CXA3222AN ...