SSC-HBMGFRT821 SEOUL [Seoul Semiconductor], SSC-HBMGFRT821 Datasheet - Page 11

• Manufacturer Part Number: SSC-HBMGFRT821
• Description: TOP LED DEVICE
• Manufacturer: SEOUL [Seoul Semiconductor]

SSC-QP-0401-06 (REV.03)
12. Precaution for use
(1) Storage
with a desiccant. Otherwise, to store them in the following environment is recommended.
(2) Attention after open.
transmission efficiency, causing the light intensity to drop. Attention in followed;
(3) In the case of more than 1 week passed after opening or change color of indicator on desiccant,
components shall be dried 10-12hr. at 60±5ºC.
(4) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to
normal temperature after soldering.
(5) Quick cooling shall be avoided.
(6) Components shall not be mounted on warped direction of PCB.
(7) Anti radioactive ray design is not considered for the products.
(8) This device should not be used in any type of fluid such as water, oil, organic solvent etc. When
washing is required, IPA should be used.
(9) When the LEDs are illuminating, operating current should be decided after considering the ambient
maximum temperature.
(10) The LEDs must be soldered within seven days after opening the moisture-proof packing.
(11) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry
place.
(12) The appearance and specifications of the product may be modified for improvement without notice.
LED is correspond to SMD, when LED be soldered dip, interfacial separation may affect the light
In order to avoid the absorption of moisture, it is recommended to store in a dry box (or a desiccator)
Temperature : 5ºC ~30ºC Humidity : maximum 70%RH
Keeping of a fraction
Temperature : 5 ~ 40ºC Humidity : less than 10%
148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea
SEOUL SEMICONDUCTOR CO., LTD.
Phone : [phone]~6
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SSC-HBMGFRT821