MC74VHC1G32DFT2 ON Semiconductor, MC74VHC1G32DFT2 Datasheet - Page 6

IC GATE OR SGL CMOS 2INP SOT353

MC74VHC1G32DFT2

Manufacturer Part Number
MC74VHC1G32DFT2
Description
IC GATE OR SGL CMOS 2INP SOT353
Manufacturer
ON Semiconductor
Series
74VHCr
Datasheet

Specifications of MC74VHC1G32DFT2

Logic Type
OR Gate
Number Of Inputs
2
Number Of Circuits
1
Current - Output High, Low
8mA, 8mA
Voltage - Supply
2 V ~ 5.5 V
Operating Temperature
-55°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
SC-70-5, SC-88A, SOT-323-5, SOT-353, 5-TSSOP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
MC74VHC1G32DFOSCT

Available stocks

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Part Number
Manufacturer
Quantity
Price
Part Number:
MC74VHC1G32DFT2
Manufacturer:
ON
Quantity:
60 000
Part Number:
MC74VHC1G32DFT2G
Manufacturer:
ON/安森美
Quantity:
20 000
Company:
Part Number:
MC74VHC1G32DFT2G
Quantity:
4 500
PUBLICATION ORDERING INFORMATION
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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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2X
2X
0.10
0.20
NOTE 5
0.05
L
T
T
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
H
1
5
A
2
G
4
3
C
B
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
T
S
D
SEATING
PLANE
5X
0.20
0.039
1.0
C A B
0.037
N. American Technical Support: 800−282−9855 Toll Free
Europe, Middle East and Africa Technical Support:
Japan Customer Focus Center
PACKAGE DIMENSIONS
0.95
SOLDERING FOOTPRINT*
USA/Canada
Phone: 421 33 790 2910
Phone: 81−3−5773−3850
http://onsemi.com
MC74VHC1G32
J
CASE 483−02
K
TSOP−5
ISSUE F
0.074
1.9
DETAIL Z
6
0.028
0.7
DETAIL Z
M
SCALE 10:1
0.094
2.4
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES
4. DIMENSIONS A AND B DO NOT INCLUDE
5. OPTIONAL CONSTRUCTION: AN
ASME Y14.5M, 1994.
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
ADDITIONAL TRIMMED LEAD IS ALLOWED
IN THIS LOCATION. TRIMMED LEAD NOT TO
EXTEND MORE THAN 0.2 FROM BODY.
DIM
inches
A
B
C
D
G
H
K
M
J
L
S
mm
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
MILLIMETERS
MIN
0.90
0.25
0.01
0.10
0.20
1.25
2.50
3.00 BSC
1.50 BSC
0.95 BSC
0
_
MAX
1.10
0.50
0.10
0.26
0.60
1.55
10
3.00
_
MC74VHC1G32/D

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