ISL29043IROMZ-EVALZ INTERSIL [Intersil Corporation], ISL29043IROMZ-EVALZ Datasheet - Page 12

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ISL29043IROMZ-EVALZ

Manufacturer Part Number
ISL29043IROMZ-EVALZ
Description
Low Power Ambient Light and Proximity Sensor with Internal IR-LED and Digital Output
Manufacturer
INTERSIL [Intersil Corporation]
Datasheet
Typical Circuit
A typical application for the ISL29043 is shown in Figure 9. The
ISL29043’s I
with x representing the logic state of input I
ADDR0. The device can be tied onto a system’s I
with other I
Soldering Considerations
Convection heating is recommended for reflow soldering;
direct-infrared heating is not recommended. The plastic ODFN
package requires a custom reflow soldering profile pursuant to
Figure 4 in TB489 (Surface Mount Assembly Guidelines for
Optical Dual Flat No Lead (ODFN) Co-Packages).
FIGURE 8. PROXIMITY COMPARISON WITHOUT LIGHT BAFFLE
250
200
150
100
50
0
0
2
C compliant devices.
2
C address is internally hardwired as 0b100010<x>,
(IRDR = 110mA)
10
NO BAFFLE, 0.1mm FROM GLASS
AGAINST GLASS, NO BAFFLE
20
NO COVER GLASS
GLASS W/ BAFFLE
30
DISTANCE (mm)
12
40
50
60
2
C address pin
70
FIGURE 7. EXAMPLE LIGHT BAFFLE DESIGN
2
C bus together
80
90
ISL29043
Suggested PCB Footprint
It is important that users check the “Surface Mount Assembly
Guidelines for Optical Dual FlatPack No Lead (ODFN) Package”
before starting ODFN product board mounting. However, this
device requires a special solder reflow profile as mentioned in
Figure 4 in TB489 (Surface Mount Guidelines for Optical
Co-packages).
http://www.intersil.com/data/tb/TB489.pdf
Layout Considerations
The ISL29043 is relatively insensitive to layout. Like other I
devices, it is intended to provide excellent performance even in
significantly noisy environments. There are only a few
considerations that will ensure best performance.
Route the supply and I
sources of noise. 0.1µF and 1µF power supply decoupling
capacitors need to be placed close to the device.
2
C traces as far as possible from all
February 9, 2012
FN7935.0
2
C

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