ACS157DMSR-02 INTERSIL [Intersil Corporation], ACS157DMSR-02 Datasheet - Page 2

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ACS157DMSR-02

Manufacturer Part Number
ACS157DMSR-02
Description
Radiation Hardened Quad 2-Input Non-Inverting Multiplexer
Manufacturer
INTERSIL [Intersil Corporation]
Datasheet
Die Characteristics
DIE DIMENSIONS:
METALLIZATION: Al
SUBSTRATE POTENTIAL:
Metallization Mask Layout
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate
and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Size: 2390 m x 2390 m (94 mils x 94 mils)
Thickness: 525 m 25 m (20.6 mils 1 mil)
Bond Pad: 110 m x 110 m (4.3 x 4.3 mils)
Metal 1 Thickness: 0.7 m 0.1 m
Metal 2 Thickness: 1.0 m 0.1 m
Unbiased Insulator
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com
2I
2I
1I
1Y
1
0
1
2Y
1I
0
ACS157MS
GND
ACS157MS
S
2
PASSIVATION
SPECIAL INSTRUCTIONS:
ADDITIONAL INFORMATION:
V
3Y
Type: Phosphorous Silicon Glass (PSG)
Thickness: 1.30 m 0.15 m
Bond V
Worst Case Density: <2.0 x 10
Transistor Count: 150
CC
OE
CC
3I
1
First
4I
4I
4Y
3I
5
0
1
0
A/cm
2

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