MP3H6115A_09 FREESCALE [Freescale Semiconductor, Inc], MP3H6115A_09 Datasheet - Page 6

• Manufacturer Part Number: MP3H6115A_09
• Description: High Temperature Accuracy Integrated Silicon Pressure Sensor
• Manufacturer: FREESCALE [Freescale Semiconductor, Inc]

MP3H6115A
6
design. The footprint for the semiconductor package must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct pad
geometry, the packages will self-align when subjected to a
Surface mount board layout is a critical portion of the total
Pressure
MINIMUM RECOMMENDED FOOTPRINT FOR SMALL AND SUPER SMALL PACKAGES
Figure 5. SSOP Footprint (Case 1317 and 1317A)
0.150
3.81
0.050
1.27
TYP
0.053 TYP 8X
1.35
solder reflow process. It is always recommended to fabricate
boards with a solder mask layer to avoid bridging and/or
shorting between solder pads, especially on tight tolerances
and/or tight layouts.
0.387
9.83
0.027 TYP 8X
0.69
inch
mm
Freescale Semiconductor
Sensors