FMS2011-000-GP FILTRONIC [Filtronic Compound Semiconductors], FMS2011-000-GP Datasheet - Page 3

• Manufacturer Part Number: FMS2011-000-GP
• Description: SP6T GaAs Multi-Band GSM Antenna Switch
• Manufacturer: FILTRONIC [Filtronic Compound Semiconductors]

Pad and Die Layout:
Note: Co-ordinates are referenced from the bottom left hand corner of the die to the centre of the
bond pad opening
Die Size (µm)
900 x 1150
Contact Details (UK):
Pad Number
Contact Details (USA): Tel: [phone]
M
A
B
C
D
E
G
H
K
N
O
P
Q
F
J
L
I
Die Thickness (µm)
Preliminary specifications subject to change without notice
Pad Name
Tel: [phone] Fax: [phone] Email: [e-mail]
VRX4
VTX2
VRX3
VRX1
VRX2
VTX1
GND
GND
GND
ANT
RX4
RX1
TX2
TX1
RX3
RX2
150 µm
VM
Filtronic Compound Semiconductors Ltd
A
C
B
D
F
E
G
H
I
Preliminary Data Sheet
Website: www.filcs.com
Common Receive Switch
RX4 Control Voltage
RX3 Control Voltage
RX1 Control Voltage
RX2 Control Voltage
TX2 Control Voltage
TX1 Control Voltage
Description
Control Voltage
TX2 RF Output
TX1 RF Output
RX4 RF Output
RX3 RF Output
RX2 RF Output
RX1 RF Output
Ground RXC
Ground 1
Ground 1
Antenna
3
Fax: [phone]
J
Min. Bond Pad
O
P
Pitch(µm)
111
N
Q
L
M
1.1
K
Pin Coordinates (µm)
Email:
130, 1037
779, 1056
103, 230
105, 347
127, 114
509, 958
779, 856
779, 302
779, 101
605, 141
620, 959
777, 511
99, 576
98, 919
98, 805
98, 689
98, 459
Min. Bond pad
[e-mail]
opening (µm)
70 x 70
FMS2011