FMS2010-000-EB FILTRONIC [Filtronic Compound Semiconductors], FMS2010-000-EB Datasheet - Page 3

• Manufacturer Part Number: FMS2010-000-EB
• Description: SP6T GaAs Multi-Band GSM Antenna Switch
• Manufacturer: FILTRONIC [Filtronic Compound Semiconductors]

Pad and Die Layout:
Note: Co-ordinates are referenced from the bottom left hand corner of the die to the centre of the
bond pad opening
Die Size (µm)
1100 x 1000
Contact Details (UK):
Pad Number
Contact Details (USA): Tel: [phone]
G
M
O
Q
A
B
C
D
E
F
H
K
N
P
J
L
I
Die Thickness (µm)
Preliminary specifications subject to change without notice
Pad Name
H
O
P
I
Tel: [phone] Fax: [phone] Email: [e-mail]
VRXC
VRX4
VTX2
VRX3
VRX1
VRX2
VTX1
GND
GND
GND
ANT
TX2
TX1
RX4
RX3
RX2
RX1
150 µm
A
Filtronic Compound Semiconductors Ltd
Preliminary Data Sheet
B
Website: www.filcs.com
Common Receive Switch
C
RX4 Control Voltage
TX2 Control Voltage
RX3 Control Voltage
RX1 Control Voltage
RX2 Control Voltage
TX1 Control Voltage
Description
Control Voltage
RX4 RF Output
RX3 RF Output
RX2 RF Output
RX1 RF Output
TX2 RF Output
TX1 RF Output
Ground 1
Ground 2
Ground 3
Antenna
D
3
Fax: [phone]
Min. Bond Pad
J
E
Pitch(µm)
113
F
1.1
Pin Coordinates (µm)
G
K
L
Q
M
N
Email:
195, 126
315, 126
440, 126
556, 126
675, 126
795, 126
919, 126
108, 904
108, 242
474, 912
988, 880
988, 750
988, 420
988, 290
108, 514
108, 627
988, 525
Min. Bond pad
[e-mail]
opening (µm)
70 x 70
FMS2010