cxm3544xr Sony Electronics, cxm3544xr Datasheet

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cxm3544xr

Manufacturer Part Number
cxm3544xr
Description
High Power Dual Path Simultaneous Dp3t Switch With Control Logic
Manufacturer
Sony Electronics
Datasheet
High Power Dual Path Simultaneous DP3T Switch with Control Logic
Description
Features
Package
Structure
Absolute Maximum Ratings
The CXM3544XR can be used in wireless communication systems, for example, dual-band/triple-band and
antenna diversity CDMA handsets. This CXM3544XR has an integrated decoder 4 CMOS control inputs. The
Sony JPHEMT process is used for low insertion loss and low distortion characteristic.
(Applications: Antenna Switch for Cellular Handsets, Dual-band/Triple-band and Antenna Diversity)
Small package XQFN 22pin (2.4mm × 3.3mm × 0.35mm) (Typ.)
GaAs JPHEMT MMIC, CMOS Logic
This IC is ESD sensitive device. Special handling precautions are required.
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license
by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating
the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
Low insertion loss: 0.30dB (Typ.) @900MHz, 0.4dB (Typ.) @2GHz
High linearity: IIP3 = 63dBm (Min.)
Low voltage operation: V
No DC blocking capacitors
4 CMOS compatible control line
Lead-Free and RoHS compliant
Bias voltage
Control voltage
Operating temperature
Storage temperature
DD
= 2.5V
V
Vctl
Topr
Tstg
DD
–65 to +150
–35 to +90
4
4
- 1 -
°
°
V
V
C
C
CXM3544XR
(Ta = 25
(Ta = 25
°
°
C)
C)
E09Y17

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cxm3544xr Summary of contents

Page 1

... Description The CXM3544XR can be used in wireless communication systems, for example, dual-band/triple-band and antenna diversity CDMA handsets. This CXM3544XR has an integrated decoder 4 CMOS control inputs. The Sony JPHEMT process is used for low insertion loss and low distortion characteristic. (Applications: Antenna Switch for Cellular Handsets, Dual-band/Triple-band and Antenna Diversity) Features Low insertion loss: 0 ...

Page 2

Block Diagram Pin Configuration GND RF5 GND GND RF4 GND GND RF5 F1 F10 RF4 F6 F11 XQFN-22Pin PKG (2.4mm × 3.3mm × 0.35mm Typ.) 15 Top View 16 17 ...

Page 3

Truth Table State CTLA CTLB CTLC CTLD RF5 (Ant1) RF4 (Ant2 ...

Page 4

Electrical Characteristics 1 ° ( 2.8V, Vctl = 0/1.8V) DD Item Symbol Control current Ictl Supply current I DD Switching speed Swt Electrical characteristics are measured with all RF ports terminated in 50Ω. ° (Ta ...

Page 5

2.8V, Vctl = 0/1.8V) DD State Item Symbol *1 1-6 Insertion loss IL 7-12 1-6 Isolation ISO 7-12 Electrical characteristics are measured with all RF ports terminated in 50Ω. *1 Control state on ...

Page 6

2.8V, Vctl = 0/1.8V) DD State Item Symbol *1 2f0 3f0 2f0 3f0 2f0 3f0 2f0 3f0 Harmonics 1-12 2f0 3f0 2f0 3f0 2f0 3f0 2f0 3f0 Electrical characteristics are measured with all ...

Page 7

2.8V, Vctl = 0/1.8V) DD State Item Symbol *1 IMD2 1-12 Inter modulation distortion IMD3 1-12 Electrical characteristics are measured with all RF ports terminated in 50Ω. Measured with the recommended circuit. *1 ...

Page 8

2.8V, Vctl = 0/1.8V) DD Item Symbol Path Triple TBR beat ratio RF4 (Ant2) –RF1 RF5 (Ant1) –RF1 Electrical characteristics are measured with all RF ports terminated in 50Ω. ...

Page 9

Electrical Characteristics 2 ° (Ta = – 2.5 to 3.2V, Vctl = 0/1.8V) DD Item Symbol Control current Ictl Supply current I DD Switching speed Swt Electrical characteristics are measured with all RF ports ...

Page 10

2.5 to 3.2V, Vctl = 0/1.8V) DD State Item Symbol *1 1-6 Insertion loss IL 7-12 1-6 Isolation ISO 7-12 Electrical characteristics are measured with all RF ports terminated in ...

Page 11

2.5 to 3.2V, Vctl = 0/1.8V) DD State Item Symbol *1 2f0 3f0 2f0 3f0 2f0 3f0 2f0 3f0 Harmonics 1-12 2f0 3f0 2f0 3f0 2f0 3f0 2f0 3f0 Electrical ...

Page 12

2.5 to 3.2V, Vctl = 0/1.8V) DD State Item Symbol *1 IMD2 1-12 Inter modulation distortion IMD3 1-12 Electrical characteristics are measured with all RF ports terminated in 50Ω. Measured ...

Page 13

Recommended Circuit C1 RF Port Port L1 Note blocking capacitors are required on all RF ports. 2. The DC levels of all RF ports are GND (27nH) and C1 (12pF) are recommended ...

Page 14

PCB Layout Template XQFN-22P-01 Macro for MMIC (Reference) Specification • PKG size: • Terminal pitch: 0.4mm • Terminal length: 0.3mm • Mask thickness: 0.11mm : Land area : Board resist open area : PKG outline 3.3mm × 2.4mm t0.35mm 3.7 ...

Page 15

Package Outline (Unit: mm) LEAD PLATING SPECIFICATIONS ITEM LEAD MATERIAL SOLDER COMPOSITION PLATING THICKNESS - 15 - SPEC. COPPER ALLOY Sn-Bi Bi:1-4wt% 5-18µm Sony Corporation ...

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