hmc557 Hittite Microwave Corporation, hmc557 Datasheet

no-image

hmc557

Manufacturer Part Number
hmc557
Description
Gaas Mmic Fundamental Mixer, 2.5 - 7.0 Ghz
Manufacturer
Hittite Microwave Corporation
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HMC557
Manufacturer:
HITTITE
Quantity:
5 000
Part Number:
HMC557
Manufacturer:
ADI/亚德诺
Quantity:
20 000
Part Number:
hmc557LC4
Manufacturer:
AVAGO
Quantity:
5 000
Part Number:
hmc557LC4
Manufacturer:
HITTITE
Quantity:
20 000
Part Number:
hmc557LC4B
Manufacturer:
HITTITE
Quantity:
20 000
Part Number:
hmc557LC4E
Manufacturer:
HITTITE
Quantity:
20 000
Part Number:
hmc557LC4TR
Manufacturer:
HITTITE
Quantity:
1 400
4 - 72
4
Typical Applications
The HMC557 is ideal for:
• WiMAX & Fixed Wireless
• Microwave Radio
• Military & Space
• Communications, Radar & EW
• Test Equipment & Sensors
Functional Diagram
Electrical Specifi cations,
Frequency Range, RF & LO
Frequency Range, IF
Conversion Loss
Noise Figure (SSB)
LO to RF Isolation
LO to IF Isolation
RF to IF Isolation
IP3 (Input)
IP2 (Input)
1 dB Gain Compression (Input)
*Unless otherwise noted, all measurements performed as downconverter, IF= 100 MHz.
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Parameter
T
A
v01.1007
= +25° C, IF= 100 MHz, LO= +15 dBm*
Order On-line at www.hittite.com
Min.
40
25
10
2.5 - 5.0
DC - 3
Typ.
48
30
18
17
50
10
7
7
Features
High LO/RF Isolation: 48 dB
Wide IF Bandwidth: DC - 3 GHz
Passive Double Balanced Topology
Low Conversion Loss: 7 dB
Small Size: 1.02 x 0.94 x 0.1 mm
General Description
The HMC557 is a passive double balanced mixer
that can be used as an upconverter or downconverter
between 2.5 and 7 GHz. The miniature monolithic
mixer is fabricated in a GaAs MESFET process, and
requires no external components or matching cir-
cuitry. The HMC557 operates with LO drive levels as
low as +9 dBm and provides excellent LO to RF and
LO to IF isolation due to optimized balun structures.
Measurements were made with the chip mounted
into in a 50 ohm test fi xture and includes the parasitic
effects of wire bond assembly. Connections were
made with a 1 mil wire bond with minimal length (<12
mil).
Max.
9.5
9.5
GaAs MMIC FUNDAMENTAL
Min.
35
22
18
MIXER, 2.5 - 7.0 GHz
5.0 - 7.0
DC - 3
Typ.
45
28
24
22
50
12
8
8
HMC557
Max.
10.5
10.5
Units
GHz
GHz
dBm
dBm
dBm
dB
dB
dB
dB
dB

Related parts for hmc557

Related keywords