hmc571 Hittite Microwave Corporation, hmc571 Datasheet - Page 4

no-image

hmc571

Manufacturer Part Number
hmc571
Description
Gaas Mmic I/q Receiver Chip, 21 - 25 Ghz
Manufacturer
Hittite Microwave Corporation
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HMC571
Manufacturer:
HITTITE
Quantity:
5 000
Part Number:
HMC571
Manufacturer:
ADI/亚德诺
Quantity:
20 000
Part Number:
hmc571LC5
Manufacturer:
TOSHIBA
Quantity:
5 000
Part Number:
hmc571LC5
Manufacturer:
HITTITE
Quantity:
20 000
Part Number:
hmc571LC5ETR
Manufacturer:
HITTITE
Quantity:
12 800
Part Number:
hmc571LC5TR
Manufacturer:
NSC
Quantity:
1 400
Absolute Maximum Ratings
Outline Drawing
RF
LO Drive
Vdd
Channel Temperature
Continuous Pdiss (T=85°C)
(derate 10.2 mW/°C above 85°C)
Thermal Resistance (R
(channel to package bottom)
Storage Temperature
Operating Temperature
ESD Sensitivity (HBM)
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
TH
)
+2 dBm
+ 13 dBm
5.5V
175°C
920 mW
98.3 °C/W
-65 to +150 °C
-55 to +85 °C
Class 1B
v02.0208
Order On-line at www.hittite.com
GaAs MMIC I/Q DOWNCONVERTER
MxN Spurious Outputs
Die Packaging Information
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
RF = 22 GHz @ -20 dBm
LO = 10.5 GHz @ +4 dBm
Data taken without IF hybrid
All values in dBc below IF power level (1RF -2LO = 1 GHz)
mRF
0
1
2
3
4
Standard
GP-1
33
67
xx
xx
xx
0
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MM]
2. DIE THICKNESS IS 0.004”
3. BOND PAD METALIZATION: GOLD
4. BACKSIDE METALIZATION: GOLD
5. BACKSIDE METAL IS GROUND
6. OVERALL DIE SIZE ±0.002
28
30
79
xx
xx
1
nLO
62
19
xx
xx
2
0
21 - 25 GHz
HMC571
Alternate
[1]
26
29
67
79
xx
[2]
3
34
44
44
87
xx
4
3 - 143
3

Related parts for hmc571