hmc519 Hittite Microwave Corporation, hmc519 Datasheet
hmc519
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hmc519 Summary of contents
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... Typical Applications The HMC519 is ideal for use as either a LNA or driver amplifi er for: • Point-to-Point Radios • Point-to-Multi-Point Radios & VSAT • Test Equipment & Sensors • Military & Space Functional Diagram Electrical Specifi cations, Parameter Frequency Range Gain Gain Variation Over Temperature ...
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... Output Return Loss vs. Temperature 0 -5 -10 -15 - Output IP3 vs. Temperature Order On-line at www.hittite.com HMC519 +25C +85C -55C FREQUENCY (GHz) +25C +85C -55C FREQUENCY (GHz) +25C +85C -55C ...
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... Gain, Noise Figure & Power vs. Supply Voltage @ 24 GHz 20 Gain 16 P1dB 12 8 Noise Figure 4 0 2.5 3 Vdd (V) Order On-line at www.hittite.com HMC519 AMPLIFIER GHz +25C +85C -55C FREQUENCY (GHz) Pout Gain PAE -15 - INPUT POWER (dBm) ...
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... OBSERVE HANDLING PRECAUTIONS [1] NOTES: 1. ALL DIMENSIONS ARE IN INCHES [MM] 2. DIE THICKNESS IS .004” 3. TYPICAL BOND IS .004” SQUARE 4. BACKSIDE METALLIZATION: GOLD 5. BOND PAD METALLIZATION: GOLD 6. BACKSIDE METAL IS GROUND. 7. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS. Order On-line at www.hittite.com HMC519 1 Idd (mA ...
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... Power Supply Voltage for the amplifi er. External bypass capacitors of 100 pF and 0.1 μF are required. This pad is AC coupled and matched to 50 Ohms. These pads must be connected to RF/DC ground for proper operation. Die Bottom must be connected to RF/DC ground. Order On-line at www.hittite.com HMC519 AMPLIFIER GHz Interface Schematic ...
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... Thick GaAs MMIC 0.076mm 0.102mm (0.004”) Thick GaAs MMIC 0.076mm 0.150mm (0.005”) Thick Moly Tab Order On-line at www.hittite.com HMC519 3 mil Ribbon Bond (0.003”) RF Ground Plane 0.127mm (0.005”) Thick Alumina Thin Film Substrate Figure 1. 3 mil Ribbon Bond (0.003” ...