hmc517 Hittite Microwave Corporation, hmc517 Datasheet - Page 4
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hmc517
Manufacturer Part Number
hmc517
Description
Low Noise Amplifier Chip, 17 - 26 Ghz
Manufacturer
Hittite Microwave Corporation
Datasheet
1.HMC517.pdf
(6 pages)
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
HMC517
Manufacturer:
HITTITE
Quantity:
5 000
Part Number:
HMC517
Manufacturer:
ADI/亚德诺
Quantity:
20 000
Company:
Part Number:
hmc517LC4
Manufacturer:
TST
Quantity:
5 000
Part Number:
hmc517LC4
Manufacturer:
HITTITE
Quantity:
20 000
Absolute Maximum Ratings
Outline Drawing
Die Packaging Information
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
Drain Bias Voltage (Vdd1, Vdd2, Vdd3)
RF Input Power (RFIN)(Vdd = +3.0 Vdc)
Channel Temperature
Continuous Pdiss (T= 85 °C)
(derate 9.8 mW/°C above 85 °C)
Thermal Resistance
(channel to die bottom)
Storage Temperature
Operating Temperature
ESD Sensitivity (HBM)
Standard
GP-2
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Alternate
v02.0907
+5.5 Vdc
+2 dBm
175 °C
0.88 W
102.6 °C/W
-65 to +150 °C
-55 to +85 °C
Class 1A
[2]
Order On-line at www.hittite.com
[1]
Typical Supply Current vs. Vdd
Note: Amplifi er will operate over full voltage ranges shown
above.
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MM]
2. DIE THICKNESS IS .004”
3. TYPICAL BOND IS .004” SQUARE
4. BACKSIDE METALLIZATION: GOLD
5. BOND PAD METALLIZATION: GOLD
6. BACKSIDE METAL IS GROUND.
7. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS.
GaAs PHEMT MMIC LOW NOISE
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
Vdd (Vdc)
+3.5
+2.5
+3.0
AMPLIFIER, 17 - 26 GHz
HMC517
Idd (mA)
61
65
69
1 - 63
1