hmc581lp6 Hittite Microwave Corporation, hmc581lp6 Datasheet - Page 5

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hmc581lp6

Manufacturer Part Number
hmc581lp6
Description
High Ip3 Dual Channel Downconverter Smt, 0.8 - 0.96 Ghz
Manufacturer
Hittite Microwave Corporation
Datasheet

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8 - 188
8
Absolute Maximum Ratings
Outline Drawing
Package Information
[1] Max peak refl ow temperature of 235 °C
[2] Max peak refl ow temperature of 260 °C
[3] 4-Digit lot number XXXX
RF / IF Input (Vdd= +5V)
LO Drive (Vdd= +5V)
Vdd (LO or IF)
Channel Temperature
Continuous Pdiss (T = 85°C)
(derate 25.5 mW/°C above 85°C)
Thermal Resistance
(channel to ground paddle)
Storage Temperature
Operating Temperature
HMC581LP6E
Part Number
HMC581LP6
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
RoHS-compliant Low Stress Injection Molded Plastic
Low Stress Injection Molded Plastic
Package Body Material
+13 dBm
+15 dBm
+7 Vdc
150°C
1.64 W
39.6 °C/W
-65 to +150°C
-40 to +85°C
v00.0806
Order On-line at www.hittite.com
DOWNCONVERTER, 800 - 960 MHz
NOTES:
1. LEADFRAME MATERIAL: COPPER ALLOY
2. DIMENSIONS ARE IN INCHES [MILLIMETERS]
3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE.
4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM.
5. PACKAGE WARP SHALL NOT EXCEED 0.05mm.
6. ALL GROUND LEADS AND GROUND PADDLE MUST BE
7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED
100% matte Sn
PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM.
SOLDERED TO PCB RF GROUND.
LAND PATTERN.
Sn/Pb Solder
Lead Finish
HMC581LP6
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
MSL Rating
HIGH IP3 RFIC DUAL
MSL1
MSL1
[1]
[2]
/
Package Marking
581LP6E
XXXX
XXXX
H581
H581
[3]

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