hmc523 Hittite Microwave Corporation, hmc523 Datasheet - Page 4

• Manufacturer Part Number: hmc523
• Description: Gaas Mmic I/q Mixer / Irm Chip, 15 - 23.6 Ghz
• Manufacturer: Hittite Microwave Corporation

Harmonics of LO
Absolute Maximum Ratings
Outline Drawing
LO = + 15 dBm
Values in dBc below input LO level measured at RF Port.
RF / IF Input
LO Drive
Channel Temperature
Continuous Pdiss (T=85°C)
(derate 5.22 mW/°C above 85°C)
Thermal Resistance (R
(junction to die bottom)
Storage Temperature
Operating Temperature
ESD Sensitivity (HBM)
LO Freq. (GHz)
15.5
18.5
21.5
20
23
17
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: [phone] Fax: [phone]
TH
)
47
49
50
47
50
53
nLO Spur at RF Port
1
+20 dBm
+27 dBm
150°C
340 mW
191.5 °C/W
-65 to +150 °C
-55 to +85 deg °C
Class 1A
v02.1007
Order On-line at www.hittite.com
56
63
73
72
71
51
2
MxN Spurious Outputs
Die Packaging Information
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
RF = 17.6 GHz @ -10 dBm
LO = 17.5 GHz @ +15 dBm
Data taken without IF hybrid
All values in dBc below IF power level
mRF
0
1
2
3
4
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
Standard
GP-2
34
87
xx
xx
xx
0
GaAs MMIC I/Q MIXER
65
87
xx
-9
1
0
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MM]
2. DIE THICKNESS IS .004”
3. TYPICAL BOND PAD IS .004”
4. BACKSIDE METALIZATION: GOLD
5. BOND PAD METALIZATION: GOLD
6. BACKSIDE METAL IS GROUND
7. CONNECTION NOT REQUIRED FOR
8. OVERALL DIE SIZE ±.002”
UNLABELED BOND PADS.
nLO
29
46
82
92
84
2
15 - 23.6 GHz
HMC523
Alternate
xx
61
62
86
92
[2]
3
[1]
xx
xx
87
90
92
4
3 - 87
3