hmc522 Hittite Microwave Corporation, hmc522 Datasheet - Page 4

• Manufacturer Part Number: hmc522
• Description: Gaas Mmic I/q Mixer / Irm Chip, 11 - 16 Ghz
• Manufacturer: Hittite Microwave Corporation

Harmonics of LO
Absolute Maximum Ratings
Outline Drawing
LO = + 15 dBm
Values in dBc below input LO level measured at RF Port.
RF / IF Input
LO Drive
Channel Temperature
Continuous Pdiss (T=85°C)
(derate 6.9 mW/°C above 85°C)
Thermal Resistance (R
(junction to die bottom)
Storage Temperature
Operating Temperature
LO Freq. (GHz)
10.5
12.5
13.5
14.5
15.5
11.5
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: [phone] Fax: [phone]
TH
43
48
48
44
44
43
1
)
nLO Spur at RF Port
46
49
60
58
51
51
2
+20 dBm
+27 dBm
150°C
452 mW
150 °C/W
-65 to +150 °C
-55 to +85 deg °C
v01.1007
52
63
67
82
61
75
3
Order On-line at www.hittite.com
80
76
61
xx
xx
xx
4
MxN Spurious Outputs
Die Packaging Information
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
RF = 13.6 GHz @ -10 dBm
LO = 13.5 GHz @ +15 dBm
Data taken without IF hybrid
All values in dBc below IF power level
mRF
0
1
2
3
4
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
Standard
GP-2
27
83
85
xx
xx
0
GaAs MMIC I/Q MIXER
69
93
86
-4
1
0
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MM]
2. DIE THICKNESS IS .004”
3. TYPICAL BOND PAD IS .004”
4. BACKSIDE METALIZATION: GOLD
5. BOND PAD METALIZATION: GOLD
6. BACKSIDE METAL IS GROUND
7. CONNECTION NOT REQUIRED FOR
8. OVERALL DIE SIZE ±.002”
UNLABELED BOND PADS.
nLO
54
70
93
93
18
2
11 - 16 GHz
HMC522
Alternate
18
57
77
81
92
[2]
3
[1]
xx
64
91
93
93
4
3 - 81
3