hmc521 Hittite Microwave Corporation, hmc521 Datasheet - Page 4

• Manufacturer Part Number: hmc521
• Description: Gaas Mmic I/q Mixer / Irm Chip, 8.5 - 13.5 Ghz
• Manufacturer: Hittite Microwave Corporation

Harmonics of LO
Absolute Maximum Ratings
Outline Drawing
LO = + 15 dBm
Values in dBc below input LO level measured at RF Port.
RF / IF Input
LO Drive
Channel Temperature
Continuous Pdiss (T=85°C)
(derate 7.07 mW/°C above 85°C)
Thermal Resistance (R
(junction to die bottom)
Storage Temperature
Operating Temperature
LO Freq. (GHz)
10.5
12.5
13.5
11.5
8.5
9.5
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: [phone] Fax: [phone]
TH
42
50
51
47
45
45
1
)
nLO Spur at RF Port
44
53
54
58
59
57
2
+20 dBm
+ 27 dBm
150°C
460 mW
141.4 °C/W
-65 to +150 °C
-55 to +85 deg °C
v01.1007
44
59
63
66
70
xx
3
Order On-line at www.hittite.com
70
77
xx
xx
xx
xx
4
MxN Spurious Outputs
Die Packaging Information
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
RF = 10.6 GHz @ -10 dBm
LO = 10.5 GHz @ +15 dBm
Data taken without IF hybrid
All values in dBc below IF power level
mRF
0
1
2
3
4
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
Standard
GP-2
27
92
92
92
xx
0
GaAs MMIC I/Q MIXER
85
92
92
-5
1
0
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MM]
2. DIE THICKNESS IS .004”
3. TYPICAL BOND PAD IS .004”
4. BACKSIDE METALIZATION: GOLD
5. BOND PAD METALIZATION: GOLD
6. BACKSIDE METAL IS GROUND
7. CONNECTION NOT REQUIRED FOR
8. OVERALL DIE SIZE ±.002”
UNLABELED BOND PADS.
nLO
29
92
92
51
76
2
8.5 - 13.5 GHz
HMC521
Alternate
23
59
82
92
92
[2]
3
[1]
52
81
92
92
92
4
3 - 75
3