hmc526 Hittite Microwave Corporation, hmc526 Datasheet - Page 4

• Manufacturer Part Number: hmc526
• Description: Gaas Mmic I/q Mixer / Irm Chip, 6 - 10 Ghz
• Manufacturer: Hittite Microwave Corporation

Harmonics of LO
Absolute Maximum Ratings
Outline Drawing
LO = +19 dBm
Values in dBc below input LO level measured at RF Port.
RF / IF Input
LO Drive
Channel Temperature
Continuous Pdiss (T=85°C)
(derate 7.8 mW/°C above 85°C)
Thermal Resistance (R
(junction to die bottom)
Storage Temperature
Operating Temperature
LO Freq. (GHz)
10.5
3.5
6.5
8.5
9.5
7.5
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: [phone] Fax: [phone]
TH
39
43
51
56
47
45
1
)
nLO Spur at RF Port
40
49
65
61
57
55
2
+20 dBm
+27 dBm
150°C
507 mW
128 °C/W
-65 to +150 °C
-55 to +85 deg °C
v01.1007
52
53
56
65
59
51
3
Order On-line at www.hittite.com
51
70
62
50
63
46
4
MxN Spurious Outputs
Die Packaging Information
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
RF = 7.6 GHz @ -10 dBm
LO = 7.5 GHz @ +19 dBm
Data taken without IF hybrid
All values in dBc below IF power level
mRF
0
1
2
3
4
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
Standard
GP-2
33
99
97
99
xx
0
GaAs MMIC I/Q MIXER
101
10
71
98
1
0
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MM]
2. DIE THICKNESS IS .004”
3. TYPICAL BOND PAD IS .004”
4. BACKSIDE METALIZATION: GOLD
5. BOND PAD METALIZATION: GOLD
6. BACKSIDE METAL IS GROUND
7. CONNECTION NOT REQUIRED FOR
8. OVERALL DIE SIZE ±.002”
UNLABELED BOND PADS.
nLO
100
29
46
75
98
2
HMC526
Alternate
6 - 10 GHz
102
18
77
70
86
[2]
3
[1]
101
107
51
68
99
4
3 - 105
3