hmc591 Hittite Microwave Corporation, hmc591 Datasheet - Page 5

• Manufacturer Part Number: hmc591
• Description: 2 Watt Power Amplifier Chip, 6 - 10 Ghz
• Manufacturer: Hittite Microwave Corporation

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3
Outline Drawing
Die Packaging Information
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
Standard
GP-1
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: [phone] Fax: [phone]
Alternate
v00.0806
[2]
Order On-line at www.hittite.com
[1]
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MM]
2. DIE THICKNESS IS .004”
3. TYPICAL BOND PAD IS .004” SQUARE
4. BACKSIDE METALLIZATION: GOLD
5. BOND PAD METALLIZATION: GOLD
6. BACKSIDE METAL IS GROUND.
7. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS.
8. OVERALL DIE SIZE ± .002
POWER AMPLIFIER, 6 - 10 GHz
GaAs PHEMT MMIC 2 WATT
HMC591