upg100b Renesas Electronics Corporation., upg100b Datasheet - Page 4

• Manufacturer Part Number: upg100b
• Description: Low Noise Wide-band Amplifier
• Manufacturer: Renesas Electronics Corporation.

10.6 MAX
OUTLINE DIMENSIONS
LEAD CONNECTIONS:
1. INPUT
2. GND
3. V
4. GND
1.0 mm
DATA SUBJECT TO CHANGE WITHOUT NOTICE
GG
(LEADS 2, 4, 6, 8) 0.6
3.8±0.2
Notes: Bonding Pad Size: 100 m Square
CALIFORNIA EASTERN LABORATORIES • Headquarters • 4590 Patrick Henry Drive • Santa Clara, CA 95054-1817 • [phone] • Telex 34-6393 • FAX [phone]
Chip Thickness: 140 10 m
Distance between Bonding Pad Outer Edge and Die Edge:
GND
70 m Typical
EXCLUSIVE NORTH AMERICAN AGENT FOR
IN
5
GND
5. OUTPUT
6. GND
7. V
8. GND
GND
PACKAGE OUTLINE B08
1.27±0.1 1.27±0.1
DD
UPG100P (CHIP)
10.6 MAX
3.8±0.2
6
4
UPG 100B
24-Hour Fax-On-Demand: 800-390-3232 (U.S. and Canada only) • Internet: http://WWW.CEL.COM
1.3 mm
V
3
7
GG
V
8
2
DD
(Units in mm)
0.4 (LEADS 1, 3, 5, 7)
1
0.2
+0.05
-0.02
GND
GND
OUT
1.7 MAX
RF, MICROWAVE & OPTOELECTRONIC SEMICONDUCTORS
* Chip Capacitor
**Recommended when cascading UPG100 with NEC's UPG100, 101,
RECOMMENDED CHIP ASSEMBLY CONDITIONS
DIE ATTACHMENT
Atmosphere:
Temperature:
AuSn Preform:
Base Material:
BONDING
Machine:
Wire:
Temperature:
Strength:
Atmosphere:
It is critical that GND points be connected to the ground with
the shortest possible wire.
TEST CIRCUIT
103B's.
IN
Thermo-compression bonding. Ultrasonic bonding is
The hard solder such as AuSi or AuGe which has
higher melting point than AuSn should not be used.
100 pF*
30 m diameter Au wire, 10 wires
Epoxy Die Attach is not recommended.
not recommended.
CuW, Cu, Kovar (Other material should not be used)
N2 gas
320 5 C
0.5 x 0.5 x 0.05
260 5 C
31
N2 gas
3g
1000 pF
1
PRINTED IN USA ON RECYCLED PAPER -10/97
3
7
t
(mm), 1 piece
1000 pF**
V
V
GG
DD
5
2, 4, 6, 8
100 pF*
OUT