bcm2153 Broadcom Corp., bcm2153 Datasheet

bcm2153

Manufacturer Part Number

bcm2153

Description

Bcm2153 - 7.2-mbps Hedge 65-nm Multimedia Baseband Processor

Manufacturer

Broadcom Corp.

Datasheet

1.BCM2153.pdf (2 pages)

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Bonase Electronics (HK) Co., Limited

Part Number:

bcm2153F0KFBG

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•

7.2-MBPS HEDGE 65-nm MULTIMEDIA BASEBAND PROCESSOR

General characteristics

• Single-chip, single-die, 7.2-Mbps HSDPA/EDGE baseband processor

• Complete system-on-a-chip, high-end multimedia with advanced audio,

• Advanced release 6-compliant equalizer and 208-Mhz ARM9™ for

• Utilizes the lowest cost, lowest power 65-nm digital CMOS process

• Compact 11 mm x 11 mm 428-pin FBGA package for low-cost

Multimedia capabilities

• Supports up to 3.2-Mpixel camera (15-fps refresh)

• 30-fps full-rate H.264, H.263, WMV9, and MPEG4 at high-quality

• Supports both encode and decode at H.264, for best quality and

• Up to 262K colors, dual-panel display support

• Extensive graphics, video, and imaging hardware acceleration blocks

• Digital TV-out (CCIR6601)

Extensive mixed-signal integration and advanced audio

• On-chip mixed-signal transceivers for 480-Mbps USB2.0 OTG

• On-chip 400-mW stereo amplifiers for speaker phone or ringer

• On-chip stereo audio DACs and 100-mW amplifiers for MP3/audio

• On-chip digital audio mixing and 5-band equalizer

• Integrated 64-tone polyphonic ringer

• Integrated MP3, AAC, AAC+, eAAC, WMA, and W-AMR codecs

• Downloadable codec capability with on-chip SRAM

Signal and voice quality

• Broadcom M-Stream technology delivers up to 3 dB better signal

• SAIC support for voice, data, echo cancelling, and noise suppression

• >95-dB SNR for high-quality stereo audio

high-speed 480-Mbps USB 2.0 OTG, full mixed-signal support for

speakers, stereo DAC audio amplifiers, and USB transceivers, with full

security, DRM and high-performance 312-MHz ARM11™ applications

processor

communications

PCB design

QVGA resolution

memory usage

quality

F E A T U R E S

NAND or NOR

USIM

or SRAM

SDRAM

Flash

Memory

TFlash

MMC

Stick

System Block Diagram

2.0 Mpix

Cam 1

BCM2048

BT+FM

BCM2153

Cam 2

30 fps

QVGA

Subsystem

HEDGE

HEDGE RF

BCM59035

LCD 1

PMU

LCD 2

BCM2153

Keypad

•

RF/PA/FEM

Enables the highest performance yet lowest cost HSDPA/EDGE

handset design

Extended coverage and fewer dropped calls using M-Stream, SAIC,

and unique WCDMA equalizer

Lowest power consumption due to advanced 65-nm process and on-

chip hardware acceleration architecture

Fastest video, audio, and data download using 480-Mbps USB 2.0

OTG

Highest quality audio and video capture and playback with H.264

QVGA hardware support

Enables smallest and thinnest design via integrated multimedia,

audio, and mixed signal

Extreme flexibility to support optional GPS, Bluetooth

mobile TV, or external multimedia processor

High-performance 312-MHz ARM11 processor for super fast

applications computing speed

Quad-band support for worldwide GSM coverage and roaming

ability

Enhanced interfaces

• Flexible memory: NOR/NAND/pSRAM/SDRAM at 104 MHz

• USB 2.0 OTG high-speed (480 Mbps)

• Two high-speed UARTs at 3.6 Mbps

• One 8-bit SDIOs at 416 Mbps, one 4-bit at 208 Mbps

• BSC, I

• Hard disk (CE-ATA)/SD/MMC and T-Flash, memory stick PRO™

• USIM controller

• ETM and JTAG for software debug

• Bluetooth/FM, Wi-Fi, and GPS support

• TV out

Mobile handsets and smartphones

USB 2.0

Charger

Vibrator

IrDA

S U M M A R Y O F B E N E F I T S

Mic.

S, SPI, and PCM interfaces

Headset

Main Speaker/

Speakerphone

Stereo

Backlight

Battery

A P P L I C A T I O N S

/FM, Wi-Fi

Related parts for bcm2153

bcm2153 Summary of contents

Page 1

... MMC 2.0 Mpix QVGA TFlash Memory USIM LCD 2 Stick Keypad Mic. IrDA NAND or NOR Flash HEDGE RF RF/PA/FEM Subsystem BCM2153 SDRAM HEDGE or SRAM Charger BCM2048 BCM59035 Vibrator BT+FM PMU S, SPI, and PCM interfaces Main Speaker/ Speakerphone Stereo Headset ...

Page 2

... EDGE/GPRS/GSM and HSDPA/WCDMA networks worldwide. The BCM2153 integrates all multimedia, analog, and stereo audio functions on a single, monolithic piece of silicon, which avoids the added cost of die- stacking and provides for lower power operation and lower BOM cost. ...

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